Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction

H. Conseil-Gudla*, Z. Staliulionis, S. Mohanty, M. S. Jellesen, J. H. Hattel, R. Ambat

*Corresponding author for this work

    Research output: Contribution to journalJournal articleResearchpeer-review

    742 Downloads (Orbit)

    Fingerprint

    Dive into the research topics of 'Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction'. Together they form a unique fingerprint.

    Engineering

    Material Science

    Keyphrases