Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction

H. Conseil-Gudla*, Z. Staliulionis, S. Mohanty, M. S. Jellesen, J. H. Hattel, R. Ambat

*Corresponding author for this work

Research output: Contribution to journalJournal articleResearchpeer-review

Abstract

Electronic devices are exposed to a wide range of climatic conditions. This study shows a reliability prediction of electronic devices exposed to different climates (from arid to humid and cold to hot regions). Temperature and humidity probability distribution functions have been calculated to indicate the change of climate exposure along year. While temperature and relative humidity (RH) are important factors in terms of water diffusion and electronic reliability, the internal climatic condition of 25 °C and 60% RH is widely used as threshold for electronic safety. Acceleration factors according to this steady state (25 °C and 60% RH) have been calculated for the different climates, and the protection offered by the enclosures has been estimated under different casing materials and resistor-capacitor (RC) simulation. This method offers a way to predict the average value of failure rate for electronic devices based on climate information and enclosure material.
Original languageEnglish
JournalMicroelectronics Reliability
Volume82
Pages (from-to)136-146
ISSN0026-2714
DOIs
Publication statusPublished - 2018

Keywords

  • Acceleration factor
  • Electronic devices
  • Humidity
  • RC simulation
  • Reliability prediction
  • Temperature

Cite this

@article{556fa0ab30ee4818b85532ccd984a886,
title = "Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction",
abstract = "Electronic devices are exposed to a wide range of climatic conditions. This study shows a reliability prediction of electronic devices exposed to different climates (from arid to humid and cold to hot regions). Temperature and humidity probability distribution functions have been calculated to indicate the change of climate exposure along year. While temperature and relative humidity (RH) are important factors in terms of water diffusion and electronic reliability, the internal climatic condition of 25 °C and 60{\%} RH is widely used as threshold for electronic safety. Acceleration factors according to this steady state (25 °C and 60{\%} RH) have been calculated for the different climates, and the protection offered by the enclosures has been estimated under different casing materials and resistor-capacitor (RC) simulation. This method offers a way to predict the average value of failure rate for electronic devices based on climate information and enclosure material.",
keywords = "Acceleration factor, Electronic devices, Humidity, RC simulation, Reliability prediction, Temperature",
author = "H. Conseil-Gudla and Z. Staliulionis and S. Mohanty and Jellesen, {M. S.} and Hattel, {J. H.} and R. Ambat",
year = "2018",
doi = "10.1016/j.microrel.2018.01.013",
language = "English",
volume = "82",
pages = "136--146",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Pergamon Press",

}

TY - JOUR

T1 - Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction

AU - Conseil-Gudla, H.

AU - Staliulionis, Z.

AU - Mohanty, S.

AU - Jellesen, M. S.

AU - Hattel, J. H.

AU - Ambat, R.

PY - 2018

Y1 - 2018

N2 - Electronic devices are exposed to a wide range of climatic conditions. This study shows a reliability prediction of electronic devices exposed to different climates (from arid to humid and cold to hot regions). Temperature and humidity probability distribution functions have been calculated to indicate the change of climate exposure along year. While temperature and relative humidity (RH) are important factors in terms of water diffusion and electronic reliability, the internal climatic condition of 25 °C and 60% RH is widely used as threshold for electronic safety. Acceleration factors according to this steady state (25 °C and 60% RH) have been calculated for the different climates, and the protection offered by the enclosures has been estimated under different casing materials and resistor-capacitor (RC) simulation. This method offers a way to predict the average value of failure rate for electronic devices based on climate information and enclosure material.

AB - Electronic devices are exposed to a wide range of climatic conditions. This study shows a reliability prediction of electronic devices exposed to different climates (from arid to humid and cold to hot regions). Temperature and humidity probability distribution functions have been calculated to indicate the change of climate exposure along year. While temperature and relative humidity (RH) are important factors in terms of water diffusion and electronic reliability, the internal climatic condition of 25 °C and 60% RH is widely used as threshold for electronic safety. Acceleration factors according to this steady state (25 °C and 60% RH) have been calculated for the different climates, and the protection offered by the enclosures has been estimated under different casing materials and resistor-capacitor (RC) simulation. This method offers a way to predict the average value of failure rate for electronic devices based on climate information and enclosure material.

KW - Acceleration factor

KW - Electronic devices

KW - Humidity

KW - RC simulation

KW - Reliability prediction

KW - Temperature

U2 - 10.1016/j.microrel.2018.01.013

DO - 10.1016/j.microrel.2018.01.013

M3 - Journal article

VL - 82

SP - 136

EP - 146

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

ER -