TY - JOUR
T1 - Hot embossing and mechanical punching of biodegradable microcontainers for oral drug delivery
AU - Petersen, Ritika Singh
AU - Mahshid, Rasoul
AU - Andersen, Nis Korsgaard
AU - Keller, Stephan Sylvest
AU - Hansen, Hans Nørgaard
AU - Boisen, Anja
PY - 2015
Y1 - 2015
N2 - A process has been developed to fabricate discrete three-dimensional microcontainers for oral drug delivery
application in Poly-L-Lactic Acid (PLLA) polymer. The method combines hot embossing for the definition
of holes in a PLLA film and mechanical punching to penetrate the polymer layer around the holes,
after filling them with drug. Here, we demonstrate the fabrication of microcontainers with a diameter
of 340 lm and a height of 50 lm. The process is temperature benign so that the compositional integrity
of the drug is preserved. It also provides a good flexibility for creating different sizes and shapes of microcontainers.
Finally, the process is compatible with roll-to-roll processing that could lead to low cost high
volume production.
© 2014 Elsevier B.V. All rights reserved.
AB - A process has been developed to fabricate discrete three-dimensional microcontainers for oral drug delivery
application in Poly-L-Lactic Acid (PLLA) polymer. The method combines hot embossing for the definition
of holes in a PLLA film and mechanical punching to penetrate the polymer layer around the holes,
after filling them with drug. Here, we demonstrate the fabrication of microcontainers with a diameter
of 340 lm and a height of 50 lm. The process is temperature benign so that the compositional integrity
of the drug is preserved. It also provides a good flexibility for creating different sizes and shapes of microcontainers.
Finally, the process is compatible with roll-to-roll processing that could lead to low cost high
volume production.
© 2014 Elsevier B.V. All rights reserved.
KW - Hot embossing
KW - Mechanical punching
KW - Biodegradable polymer
KW - Drug delivery
KW - Microcontainers
U2 - 10.1016/j.mee.2014.11.009
DO - 10.1016/j.mee.2014.11.009
M3 - Journal article
SN - 0167-9317
VL - 133
SP - 104
EP - 109
JO - Microelectronic Engineering
JF - Microelectronic Engineering
ER -