High–Precise Micro Bonding Process using a Focused Stream of Hot Air

Daniela Andrijasevic; Giuliano Bissacco; I. Giouroudi; W. Smetana; W. Brenner

High–Precise Micro Bonding Process using a Focused Stream of Hot Air

Daniela Andrijasevic, Giuliano Bissacco, I. Giouroudi, W. Smetana, W. Brenner

Vienna University of Technology

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Abstract

This paper discusses a new approach to adhesive microbonding which can overcome restrictions or drawbacks of the conventional MEMS bonding techniques. The main advantages of this technique are: low process temperature, multi material applicability, partial reversibility and partial biocompatibility. In proposed technique, the adhesive is deposited on the substrate and the micro-component is brought and placed at the requested position. Afterwards, the stream of hot air is applied in order to soften the glue and to emboss the micropart. After cooling down at room temperature, the glue hardens and final bond is achieved.

Original language	English
Title of host publication	Proceeding of the EUSPEN
Place of Publication	Baden bei Wien, Vienna, Austria
Publisher	euspen
Publication date	2006
Pages	228-231
Publication status	Published - 2006
Event	6th International Conference European Society for Precision Engineering and Nanotechnology - Baden bei Wien, Vienna, Austria Duration: 28 May 2006 → 1 Jun 2006 Conference number: 6

Conference

Conference	6th International Conference European Society for Precision Engineering and Nanotechnology
Number	6
Location	Baden bei Wien
Country/Territory	Austria
City	Vienna
Period	28/05/2006 → 01/06/2006

OpenUrl availability

Full text

Cite this

@inproceedings{2d0f341e794e491881fcb5398ec55918,

title = "High–Precise Micro Bonding Process using a Focused Stream of Hot Air",

abstract = "This paper discusses a new approach to adhesive microbonding which can overcome restrictions or drawbacks of the conventional MEMS bonding techniques. The main advantages of this technique are: low process temperature, multi material applicability, partial reversibility and partial biocompatibility. In proposed technique, the adhesive is deposited on the substrate and the micro-component is brought and placed at the requested position. Afterwards, the stream of hot air is applied in order to soften the glue and to emboss the micropart. After cooling down at room temperature, the glue hardens and final bond is achieved.",

author = "Daniela Andrijasevic and Giuliano Bissacco and I. Giouroudi and W. Smetana and W. Brenner",

year = "2006",

language = "English",

pages = "228--231",

booktitle = "Proceeding of the EUSPEN",

publisher = "euspen",

note = "6th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN-6 ; Conference date: 28-05-2006 Through 01-06-2006",

}

TY - GEN

T1 - High–Precise Micro Bonding Process using a Focused Stream of Hot Air

AU - Andrijasevic, Daniela

AU - Bissacco, Giuliano

AU - Giouroudi, I.

AU - Smetana, W.

AU - Brenner, W.

N1 - Conference code: 6

PY - 2006

Y1 - 2006

N2 - This paper discusses a new approach to adhesive microbonding which can overcome restrictions or drawbacks of the conventional MEMS bonding techniques. The main advantages of this technique are: low process temperature, multi material applicability, partial reversibility and partial biocompatibility. In proposed technique, the adhesive is deposited on the substrate and the micro-component is brought and placed at the requested position. Afterwards, the stream of hot air is applied in order to soften the glue and to emboss the micropart. After cooling down at room temperature, the glue hardens and final bond is achieved.

AB - This paper discusses a new approach to adhesive microbonding which can overcome restrictions or drawbacks of the conventional MEMS bonding techniques. The main advantages of this technique are: low process temperature, multi material applicability, partial reversibility and partial biocompatibility. In proposed technique, the adhesive is deposited on the substrate and the micro-component is brought and placed at the requested position. Afterwards, the stream of hot air is applied in order to soften the glue and to emboss the micropart. After cooling down at room temperature, the glue hardens and final bond is achieved.

M3 - Article in proceedings

SP - 228

EP - 231

BT - Proceeding of the EUSPEN

PB - euspen

CY - Baden bei Wien, Vienna, Austria

T2 - 6th International Conference European Society for Precision Engineering and Nanotechnology

Y2 - 28 May 2006 through 1 June 2006

ER -

High–Precise Micro Bonding Process using a Focused Stream of Hot Air

Abstract

Conference

OpenUrl availability

Fingerprint

Cite this