High–Precise Micro Bonding Process using a Focused Stream of Hot Air

Daniela Andrijasevic, Giuliano Bissacco, I. Giouroudi, W. Smetana, W. Brenner

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Abstract

    This paper discusses a new approach to adhesive microbonding which can overcome restrictions or drawbacks of the conventional MEMS bonding techniques. The main advantages of this technique are: low process temperature, multi material applicability, partial reversibility and partial biocompatibility. In proposed technique, the adhesive is deposited on the substrate and the micro-component is brought and placed at the requested position. Afterwards, the stream of hot air is applied in order to soften the glue and to emboss the micropart. After cooling down at room temperature, the glue hardens and final bond is achieved.
    Original languageEnglish
    Title of host publicationProceeding of the EUSPEN
    Place of PublicationBaden bei Wien, Vienna, Austria
    Publishereuspen
    Publication date2006
    Pages228-231
    Publication statusPublished - 2006
    Event6th International Conference European Society for Precision Engineering and Nanotechnology - Baden bei Wien, Vienna, Austria
    Duration: 28 May 20061 Jun 2006
    Conference number: 6

    Conference

    Conference6th International Conference European Society for Precision Engineering and Nanotechnology
    Number6
    LocationBaden bei Wien
    CountryAustria
    CityVienna
    Period28/05/200601/06/2006

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