High-throughput 3d-printing

Anja Boisen; En-te Hwu; Tien-Jen Chang

High-throughput 3d-printing

Anja Boisen (Inventor)
, En-te Hwu (Inventor)
, Tien-Jen Chang (Inventor)

Research output: Patent

96 Downloads (Orbit)

Abstract

Disclosed is a method of 3D-printing a polymer-based structure comprising at least one polymer-based substructure. The method comprised the steps of depositing a photocurable resin onto a spinnable substrate, spin coating a layer comprising said photocurable resin on said spinnable substrate by spinning said spinnable substrate, and irradiating said layer, while spinning said spinnable substrate, at one or more selected positions with a light source to cure at least a portion of said layer, thereby forming a polymer-based substructure. A system for 3D-printing a polymer-based structure comprising at least one polymer- based substructure is further disclosed.

Original language	English
IPC	G03F 7/ 16 A I
Patent number	WO2022184218
Filing date	04/03/2021
Country/Territory	International Bureau of the World Intellectual Property Organization (WIPO)
Priority date	04/03/2021
Priority number	EP20210160737
Publication status	Published - 9 Sept 2022

Access to Document

FulltextFinal published version, 3.95 MB

OpenUrl availability

Full text

Cite this

@misc{79b457f70765489d94fb1b06316147b9,

title = "High-throughput 3d-printing",

abstract = "Disclosed is a method of 3D-printing a polymer-based structure comprising at least one polymer-based substructure. The method comprised the steps of depositing a photocurable resin onto a spinnable substrate, spin coating a layer comprising said photocurable resin on said spinnable substrate by spinning said spinnable substrate, and irradiating said layer, while spinning said spinnable substrate, at one or more selected positions with a light source to cure at least a portion of said layer, thereby forming a polymer-based substructure. A system for 3D-printing a polymer-based structure comprising at least one polymer- based substructure is further disclosed.",

author = "Anja Boisen and En-te Hwu and Tien-Jen Chang",

year = "2022",

month = sep,

day = "9",

language = "English",

type = "Patent",

note = "WO2022184218; G03F 7/ 16 A I",

}

TY - PAT

T1 - High-throughput 3d-printing

AU - Boisen, Anja

AU - Hwu, En-te

AU - Chang, Tien-Jen

PY - 2022/9/9

Y1 - 2022/9/9

N2 - Disclosed is a method of 3D-printing a polymer-based structure comprising at least one polymer-based substructure. The method comprised the steps of depositing a photocurable resin onto a spinnable substrate, spin coating a layer comprising said photocurable resin on said spinnable substrate by spinning said spinnable substrate, and irradiating said layer, while spinning said spinnable substrate, at one or more selected positions with a light source to cure at least a portion of said layer, thereby forming a polymer-based substructure. A system for 3D-printing a polymer-based structure comprising at least one polymer- based substructure is further disclosed.

AB - Disclosed is a method of 3D-printing a polymer-based structure comprising at least one polymer-based substructure. The method comprised the steps of depositing a photocurable resin onto a spinnable substrate, spin coating a layer comprising said photocurable resin on said spinnable substrate by spinning said spinnable substrate, and irradiating said layer, while spinning said spinnable substrate, at one or more selected positions with a light source to cure at least a portion of said layer, thereby forming a polymer-based substructure. A system for 3D-printing a polymer-based structure comprising at least one polymer- based substructure is further disclosed.

M3 - Patent

M1 - WO2022184218

Y2 - 2021/03/04

ER -

High-throughput 3d-printing

Abstract

Access to Document

OpenUrl availability

Fingerprint

Cite this