High-throughput 3d-printing

Anja Boisen (Inventor), En-te Hwu (Inventor), Tien-Jen Chang (Inventor)

Research output: Patent

39 Downloads (Pure)


Disclosed is a method of 3D-printing a polymer-based structure comprising at least one polymer-based substructure. The method comprised the steps of depositing a photocurable resin onto a spinnable substrate, spin coating a layer comprising said photocurable resin on said spinnable substrate by spinning said spinnable substrate, and irradiating said layer, while spinning said spinnable substrate, at one or more selected positions with a light source to cure at least a portion of said layer, thereby forming a polymer-based substructure. A system for 3D-printing a polymer-based structure comprising at least one polymer- based substructure is further disclosed.

Original languageEnglish
IPCG03F 7/ 16 A I
Patent numberWO2022184218
Filing date04/03/2021
Country/TerritoryInternational Bureau of the World Intellectual Property Organization (WIPO)
Priority date04/03/2021
Priority numberEP20210160737
Publication statusPublished - 9 Sept 2022


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