Abstract
For lead-free solders in the high-temperature regime, unfortunately, a limited number of alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al based alloys. Based on these systems, possible candidate alloys were designed to have a melting range between 270°C and 350°C. Each has its own superior characteristics as well as some drawbacks however none of them can fulfill all the requirements to replace the current high-lead content solders. Even the alternative technologies that are currently being developed cannot address several critical issues of high-temperature soldering. Therefore, further research and development of high-temperature lead-free soldering is obviously needed.
Original language | English |
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Journal | Microelectronic Engineering |
Volume | 88 |
Issue number | 6 |
Pages (from-to) | 981-989 |
ISSN | 0167-9317 |
DOIs | |
Publication status | Published - 2011 |
Keywords
- Die-attaching
- Soft solder
- Thermal aging
- High-lead content solders
- Intermetallics