Abstract
We present a silicon high-pressure sensor based on fusion bonding with lateral feed-through and a compact low-cost packaging. The
sensor has a burst pressure exceeding 3000 bar and can be designed for a maximum pressure in the range from 35 to 1500 bar and
temperatures ranging from ÿ40 to 1208C. Design considerations and test results of the sensor are presented.
Keyword: Fusion bonding,Pressure sensor,Packaging
Keyword: Fusion bonding,Pressure sensor,Packaging
Original language | English |
---|---|
Journal | Sensors and Actuators A: Physical |
Volume | 2948 |
Pages (from-to) | 1-7 |
ISSN | 0924-4247 |
Publication status | Published - 2001 |
Externally published | Yes |