High-pressure silicon sensor with low-cost packaging

Karen Birkelund, Peter Gravesen, Sergey Shiryaev, Per Brandt Rasmussen, Maria Dall Rasmussen

Research output: Contribution to journalJournal articleResearchpeer-review


We present a silicon high-pressure sensor based on fusion bonding with lateral feed-through and a compact low-cost packaging. The sensor has a burst pressure exceeding 3000 bar and can be designed for a maximum pressure in the range from 35 to 1500 bar and temperatures ranging from ÿ40 to 1208C. Design considerations and test results of the sensor are presented.
Keyword: Fusion bonding,Pressure sensor,Packaging
Original languageEnglish
JournalSensors and Actuators A: Physical
Pages (from-to)1-7
Publication statusPublished - 2001
Externally publishedYes


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