Abstract
This work reports on a highly linear and high output power ultra-wideband distributed amplifier with improved thermal properties using a diamond layer for heat spreading. The performances of a circuit with and without the diamond heat spreader are compared. Adding the diamond yields a 4 dB improvement in 1 dB compression point (P1dB) and saturated output power (Psat). Intermodulation distortion has also been measured and the amplifier achieves 24 dBm OIP3 over a bandwidth larger than 60 GHz. In terms of small-signal characteristics, the circuit shows 12 dB gain and low deviation from linear phase, similarly to the non-diamond version. This amplifier demonstrates highest P1dB, OIP3, and PAE values as compared to other technologies with similar or higher bandwidth.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of 2020 IEEE/MTT-S International Microwave Symposium |
| Number of pages | 4 |
| Publisher | IEEE |
| Publication date | 2020 |
| Article number | 9223893 |
| ISBN (Print) | 9781728168159 |
| DOIs | |
| Publication status | Published - 2020 |
| Event | 2020 IEEE/MTT-S International Microwave Symposium - Los Angeles, United States Duration: 4 Aug 2020 → 6 Aug 2020 https://ieeexplore.ieee.org/xpl/conhome/9212188/proceeding |
Conference
| Conference | 2020 IEEE/MTT-S International Microwave Symposium |
|---|---|
| Country/Territory | United States |
| City | Los Angeles |
| Period | 04/08/2020 → 06/08/2020 |
| Internet address |
| Series | I E E E - M T T S International Microwave Symposium. Digest |
|---|---|
| ISSN | 0149-645X |
Keywords
- Distributed amplifier
- InP double heterojunction bipolar transistor (DHBT)
- Monolithic microwave integrated circuit (MMIC)
- Travelling wave amplifier