Hardness loss and microstructure evolution of 90% hot-rolled pure tungsten at 1200-1350°C

Ming Yu, Kang Wang, Xiang Zan, Wolfgang Pantleon, Laima Luo, Xiaoyong Zhu, Yucheng Wu

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Tungsten is a promising plasma-facing material because of its low sputtering yield, high melting point and high thermal conductivity. The hardness loss and microstructure evolution of pure tungsten hot-rolled to 90% thickness reduction is investigated by isothermal annealing at temperature range of 1200-1350°C. Changes in the mechanical properties caused by recovery and recrystallization during heat treatment are detected by Vickers hardness measurements. Additionally, the microstructural evolution is analyzed with light optical microscopy and X-ray diffraction. The results indicate that the hardness evolution can be divided into two stages: recovery and recrystallization. Recrystallization of W90 in the temperature range of 1200 to1350°C is governed by the same activation energy as grain boundary diffusion. The average recrystallized grain size is larger for lower annealing temperatures.
Original languageEnglish
JournalFusion Engineering and Design
Pages (from-to)531-536
Publication statusPublished - 2017


  • Microscopy
  • Recrystallization
  • Tungsten
  • Vickers hardness
  • X-ray diffraction

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