Abstract
This work presents a convenient and contamination safe E-beam lithography process for microstructuring of graphene flakes. Exfoliated graphene flakes were deposited on oxidized silicon wafers and subsequently patterned by E-beam lithography, to be used as source and drain electrodes in an organic field-effect transistor configuration (OFET). Single tip tungsten as well as microscale multi-point probes were used to electrically contact individual devices, making permanent connections unnecessary. The device platform has been tested with a thin film of para-hexaphenylene (p6P) as the semiconducting channel material.
Original language | English |
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Journal | Microelectronic Engineering |
Volume | 87 |
Issue number | 5-8 |
Pages (from-to) | 1120-1122 |
ISSN | 0167-9317 |
DOIs | |
Publication status | Published - 2010 |
Keywords
- E-beam lithography
- Graphene
- OFET