Grain boundary mobility during recrystallization of copper

R.A. Vandermeer, D. Juul Jensen, E. Woldt

    Research output: Contribution to journalJournal articleResearchpeer-review

    Original languageEnglish
    JournalMetallurgical and Materials Transactions A - Physical Metallurgy and Materials Science
    Volume28
    Pages (from-to)749-754
    ISSN1073-5623
    Publication statusPublished - 1997

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