Grain boundary mobility during recrystallization of copper

R.A. Vandermeer, D. Juul Jensen, E. Woldt

Research output: Contribution to journal › Journal article › Research › peer-review

Original language	English
Journal	Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science
Volume	28
Pages (from-to)	749-754
ISSN	1073-5623
Publication status	Published - 1997

Cite this

@article{5e7e92d7347143e4979af7f3e230d7b2,

title = "Grain boundary mobility during recrystallization of copper",

keywords = "Industrielle materialer",

author = "R.A. Vandermeer and {Juul Jensen}, D. and E. Woldt",

year = "1997",

language = "English",

volume = "28",

pages = "749--754",

journal = "Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science",

issn = "1073-5623",

publisher = "Springer New York",

}

TY - JOUR

T1 - Grain boundary mobility during recrystallization of copper

AU - Vandermeer, R.A.

AU - Juul Jensen, D.

AU - Woldt, E.

PY - 1997

Y1 - 1997

KW - Industrielle materialer

M3 - Journal article

VL - 28

SP - 749

EP - 754

JO - Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science

JF - Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science

SN - 1073-5623

ER -