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Fusion bonding of silicon nitride surfaces
Kasper Reck
, Christian Østergaard
,
Erik Vilain Thomsen
,
Ole Hansen
Center for Individual Nanoparticle Functionality
Research output
:
Contribution to journal
›
Journal article
›
Research
›
peer-review
Overview
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Keyphrases
Silicon Nitride
100%
Fusion Bonding
100%
Bonding Strength
33%
Refractive Index
16%
X-ray Photoelectron Spectroscopy
16%
Stoichiometry
16%
Low Pressure Chemical Vapor Deposition (LPCVD)
16%
Surface Roughness
16%
Bonding Ability
16%
Existing Knowledge
16%
Wafer
16%
Intrinsic Stress
16%
Chemical Pretreatment
16%
Oxidation Rate
16%
Silicon Surface
16%
Spectroscopic Measurement
16%
Environmental Protection
16%
Silicon Dioxide
16%
Bonded Wafer
16%
Stress Measurement
16%
Surface Oxide
16%
Thermal Oxidation
16%
Protection Studies
16%
Void Characterization
16%
Chemical Passivation
16%
Micro-electrical-mechanical Systems
16%
Electrical Isolation
16%
Direct Fusion
16%
High-temperature Bonding
16%
Oxidation Pretreatment
16%
Material Science
Silicon Nitride
100%
Silicon
33%
Oxide Surface
16%
Surface Roughness
16%
Stress Measurement
16%
Refractive Index
16%
Silicon Dioxide
16%
Low Pressure Chemical Vapor Deposition
16%
Photoemission Spectroscopy
16%