Formation of tilted clusters in the electrochemical deposition of copper on n-gas(001)

D.M. Smilgies, Robert Krarup Feidenhans'l, G. Scherb, D.M. Kolb, A. Kazimirov, J. Zegenhagen

    Research output: Contribution to journalJournal articleResearch

    Abstract

    Using in-situ synchrotron X-ray diffraction, we have studied the epitaxial properties of Cu clusters electrochemically deposited on n-GaAs(001) substrates. The Cu clusters have (001) base planes and their [100] directions are aligned with the [110] directions of the GaAs(001) surface unit cell, but with a large angular spread of 4.5 degrees. Moreover, the Cu(001) planes are tilted with respect to the GaAs(001) substrate. The tilt of about 6 degrees did not show a preference for any substrate azimuth, giving rise to a ring-shaped (111)(Cu) reflection. This epitaxial tilt seems to be a novel mechanism of strain relief in an epitaxial system with a large mismatch of lattice constants and a large surface roughness.
    Original languageEnglish
    JournalSurface Science
    Volume367
    Issue number1
    Pages (from-to)40-44
    ISSN0039-6028
    DOIs
    Publication statusPublished - 1996

    Cite this

    Smilgies, D. M., Feidenhans'l, R. K., Scherb, G., Kolb, D. M., Kazimirov, A., & Zegenhagen, J. (1996). Formation of tilted clusters in the electrochemical deposition of copper on n-gas(001). Surface Science, 367(1), 40-44. https://doi.org/10.1016/S0039-6028(96)00847-3