Fluxless flip-clip bonding for the photonic assembly:
                comparison between evaporated SnPb (60/40) and AuSn (80/20)
                solder

Jochen Friedrich Kuhmann; P. Harde; D. Pech; W. Pittroff; A. Preuss; T. Wirth; W. Österle; H. Reichl; A. Heuberger

Fluxless flip-clip bonding for the photonic assembly: comparison between evaporated SnPb (60/40) and AuSn (80/20) solder

Jochen Friedrich Kuhmann, P. Harde, D. Pech, W. Pittroff, A. Preuss, T. Wirth, W. Österle, H. Reichl (Editor), A. Heuberger (Editor)

Research output: Chapter in Book/Report/Conference proceeding › Book chapter › Research › peer-review

Original language	English
Title of host publication	Micro System Technologies 96: 5th Int. Conf. on Micro Electro, Opto, Mechanical Systems and Components
Place of Publication	Potsdam
Publication date	1996
Pages	91-97
Publication status	Published - 1996

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Kuhmann, J. F., Harde, P., Pech, D., Pittroff, W., Preuss, A., Wirth, T., Österle, W., Reichl, H. (Ed.), & Heuberger, A. (Ed.) (1996). Fluxless flip-clip bonding for the photonic assembly: comparison between evaporated SnPb (60/40) and AuSn (80/20) solder. In Micro System Technologies 96: 5th Int. Conf. on Micro Electro, Opto, Mechanical Systems and Components (pp. 91-97).

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title = "Fluxless flip-clip bonding for the photonic assembly: comparison between evaporated SnPb (60/40) and AuSn (80/20) solder",

author = "Kuhmann, \{Jochen Friedrich\} and P. Harde and D. Pech and W. Pittroff and A. Preuss and T. Wirth and W. {\"O}sterle and H. Reichl and A. Heuberger",

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Kuhmann, JF, Harde, P, Pech, D, Pittroff, W, Preuss, A, Wirth, T, Österle, W, Reichl, H (ed.) & Heuberger, A (ed.) 1996, Fluxless flip-clip bonding for the photonic assembly: comparison between evaporated SnPb (60/40) and AuSn (80/20) solder. in Micro System Technologies 96: 5th Int. Conf. on Micro Electro, Opto, Mechanical Systems and Components. Potsdam, pp. 91-97.

Fluxless flip-clip bonding for the photonic assembly: comparison between evaporated SnPb (60/40) and AuSn (80/20) solder. / Kuhmann, Jochen Friedrich; Harde, P.; Pech, D. et al.
Micro System Technologies 96: 5th Int. Conf. on Micro Electro, Opto, Mechanical Systems and Components. Potsdam, 1996. p. 91-97.

Research output: Chapter in Book/Report/Conference proceeding › Book chapter › Research › peer-review

TY - CHAP

T1 - Fluxless flip-clip bonding for the photonic assembly: comparison between evaporated SnPb (60/40) and AuSn (80/20) solder

AU - Kuhmann, Jochen Friedrich

AU - Harde, P.

AU - Pech, D.

AU - Pittroff, W.

AU - Preuss, A.

AU - Wirth, T.

AU - Österle, W.

A2 - Reichl, H.

A2 - Heuberger, A.

PY - 1996

Y1 - 1996

M3 - Book chapter

SP - 91

EP - 97

BT - Micro System Technologies 96: 5th Int. Conf. on Micro Electro, Opto, Mechanical Systems and Components

CY - Potsdam

ER -

Kuhmann JF, Harde P, Pech D, Pittroff W, Preuss A, Wirth T et al. Fluxless flip-clip bonding for the photonic assembly: comparison between evaporated SnPb (60/40) and AuSn (80/20) solder. In Micro System Technologies 96: 5th Int. Conf. on Micro Electro, Opto, Mechanical Systems and Components. Potsdam. 1996. p. 91-97