Fluxless flip-clip bonding for the photonic assembly: comparison between evaporated SnPb (60/40) and AuSn (80/20) solder

Jochen Friedrich Kuhmann, P. Harde, D. Pech, W. Pittroff, A. Preuss, T. Wirth, W. Österle, H. Reichl (Editor), A. Heuberger (Editor)

    Research output: Chapter in Book/Report/Conference proceedingBook chapterResearchpeer-review

    Original languageEnglish
    Title of host publicationMicro System Technologies 96: 5th Int. Conf. on Micro Electro, Opto, Mechanical Systems and Components
    Place of PublicationPotsdam
    Publication date1996
    Publication statusPublished - 1996

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