| Original language | English |
|---|
| Place of Publication | Lyngby |
|---|---|
| Publisher | MIC |
| Number of pages | 158 |
| Publication status | Published - 2000 |
Fluxless Flip-Chip Soldering: A Packaging Technology for Hybrid Microsystem Integration
Eddie Hjelm Pedersen
Research output: Book/Report › Book › Research › peer-review