Flip Chip Mounting of Laser Diodes with AuSn Solder Bumps;
                Bumping, Self-Alignment & Laser Behavior

Research output: Chapter in Book/Report/Conference proceeding › Book chapter › Research › peer-review

Original language	English
Title of host publication	47th ECTC
Publication date	1997
Pages	1235-1241
Publication status	Published - 1997
Event	47th Electronic Components and Technology Conference - San Jose, CA, United States Duration: 18 May 1997 → 21 May 1997 Conference number: 47 http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=4801

Conference	47th Electronic Components and Technology Conference
Number	47
Country/Territory	United States
City	San Jose, CA
Period	18/05/1997 → 21/05/1997
Internet address	http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=4801

OpenUrl availability

@inbook{6312d8cdd39843afb15c395f5903f679,

title = "Flip Chip Mounting of Laser Diodes with AuSn Solder Bumps; Bumping, Self-Alignment \& Laser Behavior",

author = "W. Pitroff and J. Barnikow and A. Klein and Kuhmann, \{Jochen Friedrich\} and U. Merkel and K. Vogel and J. W{\"u}rfel",

year = "1997",

language = "English",

pages = "1235--1241",

booktitle = "47th ECTC",

note = "47th Electronic Components and Technology Conference, ECTC 47 ; Conference date: 18-05-1997 Through 21-05-1997",

url = "http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=4801",

}

TY - CHAP

T1 - Flip Chip Mounting of Laser Diodes with AuSn Solder Bumps; Bumping, Self-Alignment & Laser Behavior

AU - Pitroff, W.

AU - Barnikow, J.

AU - Klein, A.

AU - Kuhmann, Jochen Friedrich

AU - Merkel, U.

AU - Vogel, K.

AU - Würfel, J.

N1 - Conference code: 47

PY - 1997

Y1 - 1997

M3 - Book chapter

SP - 1235

EP - 1241

BT - 47th ECTC

T2 - 47th Electronic Components and Technology Conference

Y2 - 18 May 1997 through 21 May 1997

ER -