Flip Chip Mounting of Laser Diodes with AuSn Solder Bumps; Bumping, Self-Alignment & Laser Behavior

W. Pitroff, J. Barnikow, A. Klein, Jochen Friedrich Kuhmann, U. Merkel, K. Vogel, J. Würfel

    Research output: Chapter in Book/Report/Conference proceedingBook chapterResearchpeer-review

    Original languageEnglish
    Title of host publication47th ECTC
    Publication date1997
    Pages1235-1241
    Publication statusPublished - 1997
    Event47th Electronic Components and Technology Conference - San Jose, CA, United States
    Duration: 18 May 199721 May 1997
    Conference number: 47
    http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=4801

    Conference

    Conference47th Electronic Components and Technology Conference
    Number47
    CountryUnited States
    CitySan Jose, CA
    Period18/05/199721/05/1997
    Internet address

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