Flip-Chip Hermetic Packaging for MEMS

Eddie Hjelm Pedersen, P. Rombach, Matthias Heschel, Jochen Friedrich Kuhmann

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Original languageEnglish
    Title of host publicationProceedings of Eurosensors XIV
    Place of PublicationCopenhagen, Denmark
    Publication date2000
    Publication statusPublished - 2000

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