Original language | English |
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Title of host publication | Proceedings of Eurosensors XIV |
Place of Publication | Copenhagen, Denmark |
Publication date | 2000 |
Publication status | Published - 2000 |
Flip-Chip Hermetic Packaging for MEMS
Eddie Hjelm Pedersen, P. Rombach, Matthias Heschel, Jochen Friedrich Kuhmann
Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review