| Original language | English |
|---|---|
| Title of host publication | Proceedings of Eurosensors XIV |
| Place of Publication | Copenhagen, Denmark |
| Publication date | 2000 |
| Publication status | Published - 2000 |
Flip-Chip Hermetic Packaging for MEMS
Eddie Hjelm Pedersen, P. Rombach, Matthias Heschel, Jochen Friedrich Kuhmann
Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review