Flexible Stamp for Nanoimprint Lithography

Theodor Nielsen, Rasmus H. Pedersen, Ole Hansen, T. Haatainen, A. Tollki, J. Ahopelto, Anders Kristensen

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Abstract

The design, fabrication and performance of a flexible silicon stamp for homogenous large area nanoimprint lithography (NIL) are presented. The flexible stamp is fabricated by bulk semiconductor micro machining of a 4-inch silicon wafer and consists of thick anchor like imprint areas connected by membranes. The bending stiffness difference between the imprint areas and the membranes ensures that the deformation of the stamp during the imprint process mainly takes place in the membranes, leaving the imprint structures unaffected. By this design the strong demand to the parallelism between stamp and substrate in the imprint situation is decoupled from the pressing tool and the wafer quality. The stamp consist of 1562 imprint areas (1 mm × 1 mm) containing the patterns to be replicated. The imprinted patterns are characterized with respect to the imprint depth and the polymer residual layer thickness. It is found that within a 50 mm diameter the polymer residual layer thickness is 18.8 nm with a standard deviation of 6.6 nm.
Original languageEnglish
Title of host publicationTechnical Digest of the 18th IEEE Conference on Micro Electro Mechanical Systems, MEMS 2005
PublisherIEEE
Publication date2005
Pages508-511
ISBN (Print)0-7803-8732-5
DOIs
Publication statusPublished - 2005
Event18th IEEE International Conference on Micro Electro Mechanical Systems - Miami Beach, FL, United States
Duration: 30 Jan 20053 Feb 2005
Conference number: 18

Conference

Conference18th IEEE International Conference on Micro Electro Mechanical Systems
Number18
CountryUnited States
CityMiami Beach, FL
Period30/01/200503/02/2005

Bibliographical note

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Cite this

Nielsen, T., Pedersen, R. H., Hansen, O., Haatainen, T., Tollki, A., Ahopelto, J., & Kristensen, A. (2005). Flexible Stamp for Nanoimprint Lithography. In Technical Digest of the 18th IEEE Conference on Micro Electro Mechanical Systems, MEMS 2005 (pp. 508-511). IEEE. https://doi.org/10.1109/MEMSYS.2005.1453978