Finite Element Modeling of Multi-Scale Thermal Contact Resistance

M.K. Thompson

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

Paper MNHT2008-52385: Many traditional macro scale finite element models of thermal contact systems have incorporated the effect of micro scale surface topography by applying a constant value of thermal contact conductance (TCC) per unit area to the regions in contact. However, it has been very difficult to determine an appropriate TCC value for a given system and analysts typically had to rely on experimental data or values from the literature. This work presents a method for predicting micro scale TCC per unit area by incorporating micro scale surface roughness in a multi-scale iterative thermal/structural finite element contact model. The resulting TCC value is then used in a macro scale thermal/structural contact model with apparent surface form to predict the thermal contact resistance and overall thermal resistance for a commercial power electronics module.
Original languageEnglish
Title of host publicationProceedings of the Micro Nanoscale Heat Transfer International Conference
PublisherAmerican Society of Mechanical Engineers
Publication date2008
Pages509-517
DOIs
Publication statusPublished - 2008
Externally publishedYes
EventASME 2008 1st International Conference on Micro/Nanoscale Heat Transfer - Tainan, Taiwan, Province of China
Duration: 6 Jun 20089 Jun 2008

Conference

ConferenceASME 2008 1st International Conference on Micro/Nanoscale Heat Transfer
CountryTaiwan, Province of China
CityTainan
Period06/06/200809/06/2008

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