Fast heating and cooling in nanoimprint using a spring-loaded adapter in a preheated press

Helmut Schift, Sandro Bellini, Jens Gobrecht, Frank Reuther, Mike Kubenz, Morten Bo Lindholm Mikkelsen, Konrad Vogelsang

    Research output: Contribution to journalJournal articleResearchpeer-review

    Abstract

    By using a spring-loaded adapter, instant heating and cooling of wafer-type substrates was implemented in standard hot embossing equipment. This was possible by using the well-known concept of a clamped stack of stamp and substrate, pre-assembled in an alignment fixture. A number of thermoplastic and thermocurable resists were molded in an isothermal process with total press occupancy of one cycle of less than 5 min. By further reducing overhead time for mounting and press closing, sub-minute imprint cycles seem possible.
    Original languageEnglish
    JournalMicroelectronic Engineering
    Volume84
    Pages (from-to)932-936
    ISSN0167-9317
    DOIs
    Publication statusPublished - 2007

    Keywords

    • Thermal imprint
    • Alignment fixture
    • Isothermal process
    • Thermocuring
    • Thermoplast
    • Nanoimprint lithography

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