Fabrication of Ni stamp with high aspect ratio, two-leveled, cylindrical microstructures using dry etching and electroplating: Paper

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Abstract

We describe a process for the fabrication of a Ni stamp that is applied to the microstructuring of polymers by hot embossing. The target devices are microcontainers that have a potential application in oral drug delivery. Each container is a 3D, cylindrical, high aspect ratio microstructure obtained by defining a reservoir and a separating trench with different depths of 85 and 125 μm, respectively, in a single embossing step. The fabrication of the required two leveled stamp is done using a modified DEEMO (dry etching, electroplating and molding) process. Dry etching using the Bosch process and electroplating are optimized to obtain a stamp with smooth stamp surfaces and a positive sidewall profile. Using this stamp, hot embossing is performed successfully with excellent yield and high replication fidelity.
Original languageEnglish
Article number055021
JournalJournal of Micromechanics and Microengineering
Volume25
Issue number5
Number of pages12
ISSN0960-1317
DOIs
Publication statusPublished - 2015

Keywords

  • Bosch process
  • electroplating
  • hot embossing
  • microcontainers
  • nickel stamp
  • Aspect ratio
  • Drug delivery
  • Electroplating
  • Fabrication
  • Microstructure
  • Nickel
  • High aspect ratio
  • High aspect ratio microstructures
  • Hot-embossing
  • Micro structuring
  • Oral drug delivery
  • Sidewall profiles
  • Dry etching

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