Fabrication of Microcomponents by Electrochemical Manufacturing: Advanced Feed-Through Metallisation on Silicon and Nickel Micromechanical Resonators

Peter Torben Tang, Matthias Heschel, Jan Tue Ravnkilde, Ole Hansen, Per Møller, Leo Alting

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Abstract

    Electrochemical processes such as electroplating, wet selective etching (or controlled corrosion) and electroless plating are powerful tools for fabrication of MEMS (Micro ElectroMechanical Systems) products. Especially when the electrochemical processes are used in combination with UV-lithography, silicon substrates and other processes traditionally associated with microelectronics. By replacing ceramic materials, in some parts of a MEMS structure, with metal - and introducing electrochemical manufacturing - the production costs can be significantly reduced. This will be illustrated by two very different MEMS component examples: An example uses electrochemical manufacturing to form multiple feed-though wires of copper (similar to printed circuit boards, but much smaller and on tree-dimensional surfaces) from one side of a silicon wafer to the other. In this example tin bumps for flip-chip bonding, as well as nickel/gold pads for conductive adhesive bonding, are also deposited by electroplating. The second example is a simple, inexpensive, low-temperature electroplating process for fabrication of released, stress-free nickel comb resonators. Since the manufacturing sequence only involves low-temperature steps, it is well suited for post processing on CMOS devices. The resonators have been tested using optical readout, and quality factors of around 550 have been measured in an atmospheric ambient.
    Original languageEnglish
    Title of host publication1st euspen topical conference on Fabrication and Metrology in Nanotechnology
    PublisherIPL
    Publication date2000
    Publication statusPublished - 2000
    Event1st euspen Topical Conference on Fabrication and Metrology in Nanotechnology - Copenhagen, Denmark
    Duration: 28 May 200030 May 2000

    Conference

    Conference1st euspen Topical Conference on Fabrication and Metrology in Nanotechnology
    CountryDenmark
    CityCopenhagen
    Period28/05/200030/05/2000

    Cite this

    Tang, P. T., Heschel, M., Ravnkilde, J. T., Hansen, O., Møller, P., & Alting, L. (2000). Fabrication of Microcomponents by Electrochemical Manufacturing: Advanced Feed-Through Metallisation on Silicon and Nickel Micromechanical Resonators. In 1st euspen topical conference on Fabrication and Metrology in Nanotechnology IPL.