Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.

Leif Steen Johansen, Morten Ginnerup, Peter Torben Tang, Jan Tue Ravnkilde, B. Löchel

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Original languageEnglish
    Title of host publicationFabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.
    PublisherThe Institute of Electrical Engineers of Japan
    Publication date1999
    Publication statusPublished - 1999
    Event10th International Conference on Solid-State Sensors and Actuators (Transducers ’99) - Sendai, Japan
    Duration: 1 Jan 1999 → …
    Conference number: 10

    Conference

    Conference10th International Conference on Solid-State Sensors and Actuators (Transducers ’99)
    Number10
    CountryJapan
    CitySendai
    Period01/01/1999 → …

    Cite this

    Johansen, L. S., Ginnerup, M., Tang, P. T., Ravnkilde, J. T., & Löchel, B. (1999). Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. In Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. The Institute of Electrical Engineers of Japan.
    Johansen, Leif Steen ; Ginnerup, Morten ; Tang, Peter Torben ; Ravnkilde, Jan Tue ; Löchel, B. / Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.. The Institute of Electrical Engineers of Japan, 1999.
    @inproceedings{c3951a08eab84e2a965ce6f4f1c8117c,
    title = "Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.",
    author = "Johansen, {Leif Steen} and Morten Ginnerup and Tang, {Peter Torben} and Ravnkilde, {Jan Tue} and B. L{\"o}chel",
    year = "1999",
    language = "English",
    booktitle = "Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.",
    publisher = "The Institute of Electrical Engineers of Japan",

    }

    Johansen, LS, Ginnerup, M, Tang, PT, Ravnkilde, JT & Löchel, B 1999, Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. in Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.. The Institute of Electrical Engineers of Japan, 10th International Conference on Solid-State Sensors and Actuators (Transducers ’99), Sendai, Japan, 01/01/1999.

    Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. / Johansen, Leif Steen; Ginnerup, Morten; Tang, Peter Torben; Ravnkilde, Jan Tue; Löchel, B.

    Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.. The Institute of Electrical Engineers of Japan, 1999.

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    TY - GEN

    T1 - Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.

    AU - Johansen, Leif Steen

    AU - Ginnerup, Morten

    AU - Tang, Peter Torben

    AU - Ravnkilde, Jan Tue

    AU - Löchel, B.

    PY - 1999

    Y1 - 1999

    M3 - Article in proceedings

    BT - Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.

    PB - The Institute of Electrical Engineers of Japan

    ER -

    Johansen LS, Ginnerup M, Tang PT, Ravnkilde JT, Löchel B. Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. In Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.. The Institute of Electrical Engineers of Japan. 1999