Fabrication of electroplated 3D microstructures combining KOH
                etching, electrodeposition of photoresist, and selective
                etching.

Leif Steen Johansen; Morten Ginnerup; Peter Torben Tang; Jan Tue Ravnkilde; B. Löchel

Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.

Leif Steen Johansen, Morten Ginnerup, Peter Torben Tang, Jan Tue Ravnkilde, B. Löchel

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Original language	English
Title of host publication	Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.
Publisher	The Institute of Electrical Engineers of Japan
Publication date	1999
Publication status	Published - 1999
Event	10th International Conference on Solid-State Sensors and Actuators (Transducers ’99) - Sendai, Japan Duration: 1 Jan 1999 → … Conference number: 10

Conference

Conference	10th International Conference on Solid-State Sensors and Actuators (Transducers ’99)
Number	10
Country/Territory	Japan
City	Sendai
Period	01/01/1999 → …

OpenUrl availability

Full text

Cite this

Johansen, L. S., Ginnerup, M., Tang, P. T., Ravnkilde, J. T., & Löchel, B. (1999). Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. In Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. The Institute of Electrical Engineers of Japan.

Johansen, Leif Steen ; Ginnerup, Morten ; Tang, Peter Torben et al. / Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.. The Institute of Electrical Engineers of Japan, 1999.

@inproceedings{c3951a08eab84e2a965ce6f4f1c8117c,

title = "Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.",

author = "Johansen, {Leif Steen} and Morten Ginnerup and Tang, {Peter Torben} and Ravnkilde, {Jan Tue} and B. L{\"o}chel",

year = "1999",

language = "English",

booktitle = "Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.",

publisher = "The Institute of Electrical Engineers of Japan",

note = "10th International Conference on Solid-State Sensors and Actuators (Transducers {\textquoteright}99), Transducers {\textquoteright}99 ; Conference date: 01-01-1999",

}

Johansen, LS, Ginnerup, M, Tang, PT, Ravnkilde, JT & Löchel, B 1999, Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. in Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.. The Institute of Electrical Engineers of Japan, 10th International Conference on Solid-State Sensors and Actuators (Transducers ’99), Sendai, Japan, 01/01/1999.

Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. / Johansen, Leif Steen; Ginnerup, Morten; Tang, Peter Torben et al.
Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.. The Institute of Electrical Engineers of Japan, 1999.

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

TY - GEN

T1 - Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.

AU - Johansen, Leif Steen

AU - Ginnerup, Morten

AU - Tang, Peter Torben

AU - Ravnkilde, Jan Tue

AU - Löchel, B.

N1 - Conference code: 10

PY - 1999

Y1 - 1999

M3 - Article in proceedings

BT - Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.

PB - The Institute of Electrical Engineers of Japan

T2 - 10th International Conference on Solid-State Sensors and Actuators (Transducers ’99)

Y2 - 1 January 1999

ER -

Johansen LS, Ginnerup M, Tang PT, Ravnkilde JT, Löchel B. Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching. In Fabrication of electroplated 3D microstructures combining KOH etching, electrodeposition of photoresist, and selective etching.. The Institute of Electrical Engineers of Japan. 1999