TY - JOUR
T1 - Fabrication of conductive structures in volumetric additive manufacturing through embedded 3-D printing for electronic applications
AU - Wolstrup, Anders Frem
AU - Dagnæs-Hansen, Jonathan Thorbjørn
AU - Brandt, Oskar Vitus
AU - Meile, Daniel Helmuth
AU - Kruse, Carl Sander
AU - Spangenberg, Jon
AU - Zsurzsan, Tiberiu Gabriel
N1 - Publisher Copyright:
© 2023
PY - 2023
Y1 - 2023
N2 - This study investigates the fabrication of conductive structures for electronics applications using embedded 3-D printing coupled with Volumetric Additive Manufacturing (VAM). Electrically conductive carbon grease was suspended within a resin matrix, and the samples underwent VAM printing and post-processing. The resulting three dimensional conductive structure was measured to have a resistance of 4.5 kΩ, corresponding well with the material specifications. The results showed the importance of complete encapsulation of the conductive material within the resin to preserve the conductive structure. The resistivity of the conductive grease remained unaffected, indicating no interaction with the resin. Potential enhancements to improve the structure's fidelity and broaden its range of applications is discussed. This research highlights the potential of embedded 3-D printing for fabricating conductive structures in VAM. The fabrication method allows for unprecedented avenues in developing electronic applications, such as smart sensing, smart drug delivery and cyborganics.
AB - This study investigates the fabrication of conductive structures for electronics applications using embedded 3-D printing coupled with Volumetric Additive Manufacturing (VAM). Electrically conductive carbon grease was suspended within a resin matrix, and the samples underwent VAM printing and post-processing. The resulting three dimensional conductive structure was measured to have a resistance of 4.5 kΩ, corresponding well with the material specifications. The results showed the importance of complete encapsulation of the conductive material within the resin to preserve the conductive structure. The resistivity of the conductive grease remained unaffected, indicating no interaction with the resin. Potential enhancements to improve the structure's fidelity and broaden its range of applications is discussed. This research highlights the potential of embedded 3-D printing for fabricating conductive structures in VAM. The fabrication method allows for unprecedented avenues in developing electronic applications, such as smart sensing, smart drug delivery and cyborganics.
KW - Conductive structures
KW - Electronic applications
KW - Embedded 3-D printing
KW - Multi-material
KW - Volumetric additive manufacturing
U2 - 10.1016/j.addlet.2023.100178
DO - 10.1016/j.addlet.2023.100178
M3 - Journal article
AN - SCOPUS:85174590108
SN - 2772-3690
VL - 7
JO - Additive Manufacturing Letters
JF - Additive Manufacturing Letters
M1 - 100178
ER -