Experimental study of humidity and temperature profile into electronic enclosure exposed to high humidity and thermal cycles

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Original languageEnglish
    Title of host publicationProceedings of the IMAPS Nordic Annual Conference 2015
    EditorsJ. Kutilainen
    PublisherInternational Microelectronics and packaging Society
    Publication date2015
    Pages111-117
    ISBN (Print)9781510808133
    Publication statusPublished - 2015
    EventIMAPS Nordic Annual Conference 2015 - Helsingør, Denmark
    Duration: 8 Jun 20159 Jun 2015

    Conference

    ConferenceIMAPS Nordic Annual Conference 2015
    Country/TerritoryDenmark
    CityHelsingør
    Period08/06/201509/06/2015

    Keywords

    • Humidity
    • Temperature
    • Electronic materials
    • Enclosures
    • Internal climate
    • Electronic reliability

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