@inproceedings{9f4d2735fde44593bc7a7f5d04b3f24b,
title = "Experimental study of humidity and temperature profile into electronic enclosure exposed to high humidity and thermal cycles",
keywords = "Humidity, Temperature, Electronic materials, Enclosures, Internal climate, Electronic reliability",
author = "Helene Conseil and Jellesen, {Morten Stendahl} and Rajan Ambat",
year = "2015",
language = "English",
isbn = "9781510808133",
pages = "111--117",
editor = "J. Kutilainen",
booktitle = "Proceedings of the IMAPS Nordic Annual Conference 2015",
publisher = "International Microelectronics and packaging Society",
note = "IMAPS Nordic Annual Conference 2015 ; Conference date: 08-06-2015 Through 09-06-2015",
}