Experimental study of humidity and temperature profile into electronic enclosure exposed to high humidity and thermal cycles

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Original languageEnglish
Title of host publicationProceedings of the IMAPS Nordic Annual Conference 2015
EditorsJ. Kutilainen
PublisherInternational Microelectronics and packaging Society
Publication date2015
Pages111-117
ISBN (Print)9781510808133
Publication statusPublished - 2015
EventIMAPS Nordic Annual Conference 2015 - Helsingør, Denmark
Duration: 8 Jun 20159 Jun 2015

Conference

ConferenceIMAPS Nordic Annual Conference 2015
CountryDenmark
CityHelsingør
Period08/06/201509/06/2015

Keywords

  • Humidity
  • Temperature
  • Electronic materials
  • Enclosures
  • Internal climate
  • Electronic reliability

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