Abstract
Two component injection moulding is a commercially important manufacturing process and a key technology for Moulded Interconnect Devices (MIDs). Many fascinating applications of two component or multi component polymer parts are restricted due to the weak interfacial adhesion of the polymers. A thorough understanding of the factors that influence the bond strength of polymers is necessary for multi component polymer processing. This paper investigates the effects of the process and material parameters on the bond strength of two component polymer parts and identifies the factors which can effectively control the adhesion between two polymers. The effects of environmental conditions on the bond strength after moulding are also investigated. The material selections and environmental conditions were chosen based on the suitability of MID production, but the results and discussion presented in this paper could be used as a guide of two component polymers processing for a wide range of industrial applications.
| Original language | English |
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| Title of host publication | Proceedings from PPS07 EA |
| Place of Publication | Copenhagen, Denmark |
| Publisher | Hexagon Holding ApS |
| Publication date | 2007 |
| ISBN (Print) | 87-89753-56-9 |
| Publication status | Published - 2007 |
| Event | Europe/Africa Regional Meeting 2007, August 28 – 30, 2007 : PPS07 - Gothenburg, Sweden Duration: 1 Jan 2007 → … Conference number: 23 |
Conference
| Conference | Europe/Africa Regional Meeting 2007, August 28 – 30, 2007 : PPS07 |
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| Number | 23 |
| City | Gothenburg, Sweden |
| Period | 01/01/2007 → … |