Evolution of the microstructure in electrochemically deposited copper films at room temperature

    Research output: Contribution to journalConference articleResearchpeer-review

    Abstract

    The room temperature evolution of the microstructure in copper electrodeposits (self-annealing) was investigated by means of X-ray diffraction analysis and simultaneous measurement of the electrical resistivity as a function of time with an unprecedented time resolution. Independent of the copper film thickness, the as-deposited microstructure consisted of nanocrystalline grains with orientation dependent crystallite sizes. A drastic decrease of the electrical resistivity occurs as a function of time associated with orientation dependent grain growth. Simulatenously with grain growth the crystallographic texture changes by a multiple twinning mechanism. The kinetics of self-annealing is strongly affected by the thickness of the deposit. Storage of the copper films at sub-zero temperatures effectively hinders self-annealing and does not affect the kinetics of self-annealing upon reheating to room temperature.
    Original languageEnglish
    JournalMaterials Science Forum
    Volume558-559
    Pages (from-to)1261-1264
    ISSN0255-5476
    Publication statusPublished - 2007
    Event3rd International Conference on Recrystallization and Grain Growth - Jeju Island, Korea, Republic of
    Duration: 10 Jun 200715 Jun 2007
    Conference number: 3
    http://www.rex-gg-2007.org/

    Conference

    Conference3rd International Conference on Recrystallization and Grain Growth
    Number3
    CountryKorea, Republic of
    CityJeju Island
    Period10/06/200715/06/2007
    Internet address

    Cite this