Evolution of the microstructure in electrochemically deposited copper films at room temperature

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    The room temperature evolution of the microstructure in copper electrodeposits (self-annealing) was investigated by means of X-ray diffraction analysis and simultaneous measurement of the electrical resistivity as a function of time with an unprecedented time resolution. Independent of the copper film thickness, the as-deposited microstructure consisted of nanocrystalline grains with orientation dependent crystallite sizes. A drastic decrease of the electrical resistivity occurs as a function of time associated with orientation dependent grain growth. Simulatenously with grain growth the crystallographic texture changes by a multiple twinning mechanism. The kinetics of self-annealing is strongly affected by the thickness of the deposit. Storage of the copper films at sub-zero temperatures effectively hinders self-annealing and does not affect the kinetics of self-annealing upon reheating to room temperature.
    Original languageEnglish
    JournalMaterials Science Forum
    Pages (from-to)1261-1264
    Publication statusPublished - 2007
    Event3rd International Conference on Recrystallization and Grain Growth - Jeju Island, Korea, Republic of
    Duration: 10 Jun 200715 Jun 2007
    Conference number: 3


    Conference3rd International Conference on Recrystallization and Grain Growth
    CountryKorea, Republic of
    CityJeju Island
    Internet address

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