Estimation of Water Diffusion Coefficient into Polycarbonate at Different Temperatures Using Numerical Simulation

Parizad Shojaee Nasirabadi; Mirmasoud Jabbaribehnam; Jesper Henri Hattel

doi:10.1063/1.4951801

Estimation of Water Diffusion Coefficient into Polycarbonate at Different Temperatures Using Numerical Simulation

Parizad Shojaee Nasirabadi, Mirmasoud Jabbaribehnam, Jesper Henri Hattel

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Abstract

Nowadays, many electronic systems are exposed to harsh conditions of relative humidity and temperature. Masstransport properties of electronic packaging materials are needed in order to investigate the influence of moisture andtemperature on reliability of electronic devices. Polycarbonate (PC) is widely used in the electronics industry. Thus, in this work the water diffusion coefficient into PC is investigated. Furthermore, numerical methods used for estimation of the diffusion coefficient and their assumptions are discussed. 1D and 3D numerical solutions are compared and based on this, itis shown how the estimated value can be different depending on the choice of dimensionality in the model.

Original language	English
Article number	030045
Journal	A I P Conference Proceedings Series
Volume	1738
Number of pages	4
ISSN	0094-243X
DOIs	https://doi.org/10.1063/1.4951801
Publication status	Published - 2016
Event	13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015) - Rhodes, Greece Duration: 22 Sep 2015 → 28 Sep 2015 http://icnaam.org/

Conference

Conference	13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)
Location	Rhodes,
Country/Territory	Greece
Period	22/09/2015 → 28/09/2015
Internet address	http://icnaam.org/

Keywords

Moisture
Diffusion
CFD
Enclosure

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title = "Estimation of Water Diffusion Coefficient into Polycarbonate at Different Temperatures Using Numerical Simulation",

abstract = "Nowadays, many electronic systems are exposed to harsh conditions of relative humidity and temperature. Masstransport properties of electronic packaging materials are needed in order to investigate the influence of moisture andtemperature on reliability of electronic devices. Polycarbonate (PC) is widely used in the electronics industry. Thus, in this work the water diffusion coefficient into PC is investigated. Furthermore, numerical methods used for estimation of the diffusion coefficient and their assumptions are discussed. 1D and 3D numerical solutions are compared and based on this, itis shown how the estimated value can be different depending on the choice of dimensionality in the model.",

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journal = "A I P Conference Proceedings Series",

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AU - Shojaee Nasirabadi, Parizad

AU - Jabbaribehnam, Mirmasoud

AU - Hattel, Jesper Henri

PY - 2016

Y1 - 2016

N2 - Nowadays, many electronic systems are exposed to harsh conditions of relative humidity and temperature. Masstransport properties of electronic packaging materials are needed in order to investigate the influence of moisture andtemperature on reliability of electronic devices. Polycarbonate (PC) is widely used in the electronics industry. Thus, in this work the water diffusion coefficient into PC is investigated. Furthermore, numerical methods used for estimation of the diffusion coefficient and their assumptions are discussed. 1D and 3D numerical solutions are compared and based on this, itis shown how the estimated value can be different depending on the choice of dimensionality in the model.

AB - Nowadays, many electronic systems are exposed to harsh conditions of relative humidity and temperature. Masstransport properties of electronic packaging materials are needed in order to investigate the influence of moisture andtemperature on reliability of electronic devices. Polycarbonate (PC) is widely used in the electronics industry. Thus, in this work the water diffusion coefficient into PC is investigated. Furthermore, numerical methods used for estimation of the diffusion coefficient and their assumptions are discussed. 1D and 3D numerical solutions are compared and based on this, itis shown how the estimated value can be different depending on the choice of dimensionality in the model.

KW - Moisture

KW - Diffusion

KW - CFD

KW - Enclosure

U2 - 10.1063/1.4951801

DO - 10.1063/1.4951801

M3 - Conference article

VL - 1738

JO - A I P Conference Proceedings Series

JF - A I P Conference Proceedings Series

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T2 - 13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)

Y2 - 22 September 2015 through 28 September 2015

ER -

Estimation of Water Diffusion Coefficient into Polycarbonate at Different Temperatures Using Numerical Simulation

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