Estimation of Water Diffusion Coefficient into Polycarbonate at Different Temperatures Using Numerical Simulation

Parizad Shojaee Nasirabadi, Mirmasoud Jabbaribehnam, Jesper Henri Hattel

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Abstract

Nowadays, many electronic systems are exposed to harsh conditions of relative humidity and temperature. Masstransport properties of electronic packaging materials are needed in order to investigate the influence of moisture andtemperature on reliability of electronic devices. Polycarbonate (PC) is widely used in the electronics industry. Thus, in this work the water diffusion coefficient into PC is investigated. Furthermore, numerical methods used for estimation of the diffusion coefficient and their assumptions are discussed. 1D and 3D numerical solutions are compared and based on this, itis shown how the estimated value can be different depending on the choice of dimensionality in the model.
Original languageEnglish
Article number030045
JournalA I P Conference Proceedings Series
Volume1738
Number of pages4
ISSN0094-243X
DOIs
Publication statusPublished - 2016
Event13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015) - Rhodes, Greece
Duration: 22 Sep 201528 Sep 2015
http://icnaam.org/

Conference

Conference13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)
LocationRhodes,
CountryGreece
Period22/09/201528/09/2015
Internet address

Keywords

  • Moisture
  • Diffusion
  • CFD
  • Enclosure

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