Nowadays, many electronic systems are exposed to harsh conditions of relative humidity and temperature. Masstransport properties of electronic packaging materials are needed in order to investigate the influence of moisture andtemperature on reliability of electronic devices. Polycarbonate (PC) is widely used in the electronics industry. Thus, in this work the water diffusion coefficient into PC is investigated. Furthermore, numerical methods used for estimation of the diffusion coefficient and their assumptions are discussed. 1D and 3D numerical solutions are compared and based on this, itis shown how the estimated value can be different depending on the choice of dimensionality in the model.
|Journal||A I P Conference Proceedings Series|
|Number of pages||4|
|Publication status||Published - 2016|
|Event||13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015) - Rhodes, Greece|
Duration: 22 Sep 2015 → 28 Sep 2015
|Conference||13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)|
|Period||22/09/2015 → 28/09/2015|