Encapsulation for a three-dimensional microsystem

Jakob Janting (Inventor), Jens Anders Branebjerg (Inventor), Pirmin Rombach (Inventor)

Research output: Patent

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Abstract

The present invention relates to an encapsulation for a microsystem. The microsystems may comprise a sensor, transducer, actuator, MEMS or other three-dimensional microsystems. The encapsulation may serve as a protection against environments such as, chemical attack, physical attack, fluid penetration and Electro Magnetic Interference. The choice of materials of the encapsulation depends on the object of encapsulation. The actual encapsulation may be applied by providing a first layer of a first material onto at least part of an outer surface of the microsystem, providing a second layer of a second material onto the first layer
Original languageEnglish
IPCB81B7/00; G01L9/00
Patent numberWO200126136
Filing date12/04/2001
CountryInternational Bureau of the World Intellectual Property Organization (WIPO)
Priority date05/10/1999
Priority numberDK19990001428
Publication statusPublished - 12 Apr 2001
Externally publishedYes

Bibliographical note

Also published as: WO0126136 (A3) & AU7645300 (A)

Cite this

Janting, J., Branebjerg, J. A., & Rombach, P. (2001). IPC No. B81B7/00; G01L9/00. Encapsulation for a three-dimensional microsystem. (Patent No. WO200126136).