Encapsulation for a three-dimensional microsystem

Jakob Janting; Jens Anders Branebjerg; Pirmin Rombach

Encapsulation for a three-dimensional microsystem

Jakob Janting (Inventor), Jens Anders Branebjerg (Inventor), Pirmin Rombach (Inventor)

Research output: Patent

43 Downloads (Pure)

Abstract

The present invention relates to an encapsulation for a microsystem. The microsystems may comprise a sensor, transducer, actuator, MEMS or other three-dimensional microsystems. The encapsulation may serve as a protection against environments such as, chemical attack, physical attack, fluid penetration and Electro Magnetic Interference. The choice of materials of the encapsulation depends on the object of encapsulation. The actual encapsulation may be applied by providing a first layer of a first material onto at least part of an outer surface of the microsystem, providing a second layer of a second material onto the first layer

Original language	English
IPC	B81B7/00; G01L9/00
Patent number	WO200126136
Filing date	12/04/2001
Country	International Bureau of the World Intellectual Property Organization (WIPO)
Priority date	05/10/1999
Priority number	DK19990001428
Publication status	Published - 12 Apr 2001
Externally published	Yes

Bibliographical note

Also published as: WO0126136 (A3) & AU7645300 (A)

Access to Document

WO0126136A2Final published version, 1.69 MB

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@misc{06ad48567cc14f4c961a67a8871f503e,

title = "Encapsulation for a three-dimensional microsystem",

abstract = "The present invention relates to an encapsulation for a microsystem. The microsystems may comprise a sensor, transducer, actuator, MEMS or other three-dimensional microsystems. The encapsulation may serve as a protection against environments such as, chemical attack, physical attack, fluid penetration and Electro Magnetic Interference. The choice of materials of the encapsulation depends on the object of encapsulation. The actual encapsulation may be applied by providing a first layer of a first material onto at least part of an outer surface of the microsystem, providing a second layer of a second material onto the first layer",

author = "Jakob Janting and Branebjerg, {Jens Anders} and Pirmin Rombach",

note = "Also published as: WO0126136 (A3) & AU7645300 (A) ; WO200126136; B81B7/00; G01L9/00",

year = "2001",

month = apr,

day = "12",

language = "English",

type = "Patent",

}

TY - PAT

T1 - Encapsulation for a three-dimensional microsystem

AU - Janting, Jakob

AU - Branebjerg, Jens Anders

AU - Rombach, Pirmin

N1 - Also published as: WO0126136 (A3) & AU7645300 (A)

PY - 2001/4/12

Y1 - 2001/4/12

N2 - The present invention relates to an encapsulation for a microsystem. The microsystems may comprise a sensor, transducer, actuator, MEMS or other three-dimensional microsystems. The encapsulation may serve as a protection against environments such as, chemical attack, physical attack, fluid penetration and Electro Magnetic Interference. The choice of materials of the encapsulation depends on the object of encapsulation. The actual encapsulation may be applied by providing a first layer of a first material onto at least part of an outer surface of the microsystem, providing a second layer of a second material onto the first layer

AB - The present invention relates to an encapsulation for a microsystem. The microsystems may comprise a sensor, transducer, actuator, MEMS or other three-dimensional microsystems. The encapsulation may serve as a protection against environments such as, chemical attack, physical attack, fluid penetration and Electro Magnetic Interference. The choice of materials of the encapsulation depends on the object of encapsulation. The actual encapsulation may be applied by providing a first layer of a first material onto at least part of an outer surface of the microsystem, providing a second layer of a second material onto the first layer

M3 - Patent

M1 - WO200126136

Y2 - 2001/04/12

ER -