Abstract
The present invention relates to an encapsulation for a microsystem. The microsystems may comprise a sensor, transducer, actuator, MEMS or other three-dimensional microsystems. The encapsulation may serve as a protection against environments such as, chemical attack, physical attack, fluid penetration and Electro Magnetic Interference. The choice of materials of the encapsulation depends on the object of encapsulation. The actual encapsulation may be applied by providing a first layer of a first material onto at least part of an outer surface of the microsystem, providing a second layer of a second material onto the first layer
| Original language | English |
|---|---|
| IPC | B81B7/00; G01L9/00 |
| Patent number | WO200126136 |
| Filing date | 12/04/2001 |
| Country | International Bureau of the World Intellectual Property Organization (WIPO) |
| Priority date | 05/10/1999 |
| Priority number | DK19990001428 |
| Publication status | Published - 12 Apr 2001 |
| Externally published | Yes |
Bibliographical note
Also published as: WO0126136 (A3) & AU7645300 (A)Cite this
Janting, J., Branebjerg, J. A., & Rombach, P. (2001). IPC No. B81B7/00; G01L9/00. Encapsulation for a three-dimensional microsystem. (Patent No. WO200126136).