Electrostatic energy harvesting device with out-of-the-plane gap closing scheme

Fei Wang, Ole Hansen

Research output: Contribution to journalJournal articleResearchpeer-review


In this paper, we report on an electrostatic energy harvester with an out-of-the-plane gap closing scheme. Using advanced MEMS technology, energy harvesting devices formed by a four wafer stack are batch fabricated and fully packaged at wafer scale. A spin coated CYTOP polymer is used both as an electret material and an adhesive layer for low temperature wafer bonding. The overall size of the device is about 1.1 cm × 1.3 cm. At an external load resistance of 13.4 MΩ, a power output of 0.15 μW is achieved when vibration at an acceleration amplitude of 1 g (∼9.8 m/s2) is applied at a low frequency of 96 Hz. The frequency response of the device is also measured and a broader bandwidth is observed at higher acceleration amplitude.
Original languageEnglish
JournalSensors and Actuators A: Physical
Pages (from-to)131-137
Number of pages7
Publication statusPublished - 2014


  • Electrets
  • Energy harvesting
  • MEMS
  • Wireless sensor networks
  • Frequency response
  • Magnetic anisotropy
  • Acceleration amplitude
  • Adhesive layers
  • Electret materials
  • Electrostatic energies
  • Energy harvesting device
  • Low temperature wafer bonding
  • MEMS technology

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