Electrostatic energy harvesting device with out-of-plane gap closing scheme

Ole Hansen, Fei Wang

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

In this paper, we report on an electrostatic energy harvester with an out-of-the-plane gap closing scheme. Using advanced MEMS technology, energy harvesting devices with a four wafer stack are batch fabricated and fully packaged at wafer scale. CYTOP polymer is used both as an electret material and an adhesive layer for low temperature wafer bonding. The overall size of the device is about 1.1×1.3 cm2. With an external load of 13.4 MΩ, a power output of 0.15 μW is achieved when vibration at an acceleration amplitude of 1 g (~9.8 m/s2) is applied at a low frequency of 96 Hz. The frequency response of the device is also measured and a broader bandwidth is observed at higher acceleration amplitude.
Original languageEnglish
Title of host publicationProceedings of the The 17th International Conference on Solid-State Sensors, Actuators and Microsystems
PublisherIEEE
Publication date2013
Pages2237-2240
ISBN (Print)9781467359832
DOIs
Publication statusPublished - 2013
Event17th International Conference on Solid-State Sensors, Actuators and Microsystems - Centro de Convenciones Internacional de Barcelona (CCIB) , Barcelona, Spain
Duration: 16 Jun 201320 Jun 2013
Conference number: 17
http://transducers-eurosensors2013.org/

Conference

Conference17th International Conference on Solid-State Sensors, Actuators and Microsystems
Number17
LocationCentro de Convenciones Internacional de Barcelona (CCIB)
CountrySpain
CityBarcelona
Period16/06/201320/06/2013
Internet address

Keywords

  • Energy Harvesting
  • Electrets
  • MEMS
  • CYTOP

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