Electromagnetic modeling and optimization of packaged photodetector modules for 100 Gbit/s applications

Chenhui Jiang, Viktor Krozer, H-G Bach, G G Mekonnen, Tom Keinicke Johansen, R Zhang, D Pech

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearch

    437 Downloads (Pure)

    Abstract

    In this paper, we propose an accurate full 3D EM behavioral model of PD chips for the first time. The model, which is meshed at 130 GHz, runs for about 17 minutes on an Intel Core2 Duo CPU@3 GHz PC with 3.5 GB of RAM. The impact of various parameters in wire- bonding transitions for transmission characteristic is summarized in the Table I. When numbers of bonding wires are placed separately all through strips of CBCPWs as well as keeping an optimized gap of transitions, more than 10 GHz bandwidth improvement can be achieved compared the worst case. We also notice that optimization on bonding wires does not significantly improve the fast decay beyond 60 GHz. Further investigation and optimization of the transition is required including a redesign of the CBCPW.
    Original languageEnglish
    Title of host publicationAsia-Pacific Microwave Conference, 2008. APMC 2008.
    PublisherIEEE
    Publication date2008
    Pages1-4
    ISBN (Print)978-1-4244-2641-6
    DOIs
    Publication statusPublished - 2008
    Event2008 Asia Pacific Microwave Conference - Macau & Hong Kong, Macau, China
    Duration: 16 Dec 200820 Dec 2008

    Conference

    Conference2008 Asia Pacific Microwave Conference
    LocationMacau & Hong Kong
    Country/TerritoryChina
    CityMacau
    Period16/12/200820/12/2008

    Bibliographical note

    Copyright: 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

    Fingerprint

    Dive into the research topics of 'Electromagnetic modeling and optimization of packaged photodetector modules for 100 Gbit/s applications'. Together they form a unique fingerprint.

    Cite this