Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Daniel Minzari; Morten Stendahl Jellesen; Per Møller; Pia Wahlberg; Rajan Ambat

doi:10.1109/TDMR.2009.2022631

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Daniel Minzari
, Morten Stendahl Jellesen
, Per Møller
, Pia Wahlberg
, Rajan Ambat

Danish Technological Institute

Research output: Contribution to journal › Journal article › Research › peer-review

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Abstract

Electrochemical migration behavior of end terminals on ceramic chip resistors (CCRs) was studied using a novel experimental setup in varying sodium chloride concentrations from 0 to 1000 ppm. The chip resistor used for the investigation was 10-kΩ CCR size 0805 with end terminals made of 97Sn3Pb alloy. Anodic polarization behavior of the electrode materials was investigated using a microelectrochemical setup. Material makeup of the chip resistor was investigated using scanning electron microscopy (SEM)/energy dispersive spectroscopy and focused-ion-beam SEM. Results showed that the dissolution rate of the Sn and stability of Sn ions in the solution layer play a significant role in the formation of dendrites, which is controlled by chloride concentration and potential bias. Morphology, composition, and resistance of the dendrites were dependent on chloride concentration and potential.

Original language	English
Journal	I E E E Transactions on Device and Materials Reliability
Volume	9
Issue number	3
Pages (from-to)	392-402
ISSN	1530-4388
DOIs	https://doi.org/10.1109/TDMR.2009.2022631
Publication status	Published - 2009

Bibliographical note

Copyright: 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

Keywords

Environmental testing
Corrosion testing
Failure
Tin
Electrochemical analysis

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249678 - Electrochemical Migration Daniel MinzariFinal published version, 1.55 MB

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@article{5d668fee04304467985d628970e51c2a,

title = "Electrochemical Migration on Electronic Chip Resistors in Chloride Environments",

abstract = "Electrochemical migration behavior of end terminals on ceramic chip resistors (CCRs) was studied using a novel experimental setup in varying sodium chloride concentrations from 0 to 1000 ppm. The chip resistor used for the investigation was 10-kΩ CCR size 0805 with end terminals made of 97Sn3Pb alloy. Anodic polarization behavior of the electrode materials was investigated using a microelectrochemical setup. Material makeup of the chip resistor was investigated using scanning electron microscopy (SEM)/energy dispersive spectroscopy and focused-ion-beam SEM. Results showed that the dissolution rate of the Sn and stability of Sn ions in the solution layer play a significant role in the formation of dendrites, which is controlled by chloride concentration and potential bias. Morphology, composition, and resistance of the dendrites were dependent on chloride concentration and potential.",

keywords = "Environmental testing, Corrosion testing, Failure, Tin, Electrochemical analysis",

author = "Daniel Minzari and Jellesen, \{Morten Stendahl\} and Per M{\o}ller and Pia Wahlberg and Rajan Ambat",

note = "Copyright: 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE",

year = "2009",

doi = "10.1109/TDMR.2009.2022631",

language = "English",

volume = "9",

pages = "392--402",

journal = "I E E E Transactions on Device and Materials Reliability",

issn = "1530-4388",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "3",

}

TY - JOUR

T1 - Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

AU - Minzari, Daniel

AU - Jellesen, Morten Stendahl

AU - Møller, Per

AU - Wahlberg, Pia

AU - Ambat, Rajan

N1 - Copyright: 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

PY - 2009

Y1 - 2009

N2 - Electrochemical migration behavior of end terminals on ceramic chip resistors (CCRs) was studied using a novel experimental setup in varying sodium chloride concentrations from 0 to 1000 ppm. The chip resistor used for the investigation was 10-kΩ CCR size 0805 with end terminals made of 97Sn3Pb alloy. Anodic polarization behavior of the electrode materials was investigated using a microelectrochemical setup. Material makeup of the chip resistor was investigated using scanning electron microscopy (SEM)/energy dispersive spectroscopy and focused-ion-beam SEM. Results showed that the dissolution rate of the Sn and stability of Sn ions in the solution layer play a significant role in the formation of dendrites, which is controlled by chloride concentration and potential bias. Morphology, composition, and resistance of the dendrites were dependent on chloride concentration and potential.

AB - Electrochemical migration behavior of end terminals on ceramic chip resistors (CCRs) was studied using a novel experimental setup in varying sodium chloride concentrations from 0 to 1000 ppm. The chip resistor used for the investigation was 10-kΩ CCR size 0805 with end terminals made of 97Sn3Pb alloy. Anodic polarization behavior of the electrode materials was investigated using a microelectrochemical setup. Material makeup of the chip resistor was investigated using scanning electron microscopy (SEM)/energy dispersive spectroscopy and focused-ion-beam SEM. Results showed that the dissolution rate of the Sn and stability of Sn ions in the solution layer play a significant role in the formation of dendrites, which is controlled by chloride concentration and potential bias. Morphology, composition, and resistance of the dendrites were dependent on chloride concentration and potential.

KW - Environmental testing

KW - Corrosion testing

KW - Failure

KW - Tin

KW - Electrochemical analysis

U2 - 10.1109/TDMR.2009.2022631

DO - 10.1109/TDMR.2009.2022631

M3 - Journal article

SN - 1530-4388

VL - 9

SP - 392

EP - 402

JO - I E E E Transactions on Device and Materials Reliability

JF - I E E E Transactions on Device and Materials Reliability

IS - 3

ER -

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

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