Electrochemical migration of lead-free solder alloys in Na2SO4 environment

Balint Medgyes; Sándor  Ádám; Lajos  Tar; Vadimas Verdingovas; Rajan Ambat; Gábor  Harsányi

doi:10.1109/ISSE.2017.8000932

Electrochemical migration of lead-free solder alloys in Na2SO4 environment

Balint Medgyes
, Sándor Ádám
, Lajos Tar
, Vadimas Verdingovas
, Rajan Ambat
, Gábor Harsányi

Budapest University of Technology and Economics

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

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Abstract

The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of 0.1 and 1 mM Na2SO4 solutions X alloy (composition in wt%: Sn=90,95%, Ag=3,8%, Cu=0,7%, Bi=3%, Sb=1,4%, Ni=0,15%) has higher migration susceptibility than SAC305 alloy (composition in wt%: Sn=96,5%, Ag=3%, Cu=0,5%). However on higher concentration levels, MTTF decreased and the failures usually happened in the same time on each solder alloy type. Failures were not happened in the case of X covered boards in case of 10 mM concentration.

Original language	English
Title of host publication	Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017
Number of pages	6
Publisher	IEEE
Publication date	2017
ISBN (Electronic)	978-1-5386-0582-0
DOIs	https://doi.org/10.1109/ISSE.2017.8000932
Publication status	Published - 2017
Event	40th International Spring Seminar on Electronics Technology - Sofia, Bulgaria Duration: 10 May 2017 → 14 May 2017

Conference

Conference	40th International Spring Seminar on Electronics Technology
Country/Territory	Bulgaria
City	Sofia
Period	10/05/2017 → 14/05/2017

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@inproceedings{eb076d54343c4b549f3bb65f89e66b0f,

title = "Electrochemical migration of lead-free solder alloys in Na2SO4 environment",

abstract = "The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of 0.1 and 1 mM Na2SO4 solutions X alloy (composition in wt\%: Sn=90,95\%, Ag=3,8\%, Cu=0,7\%, Bi=3\%, Sb=1,4\%, Ni=0,15\%) has higher migration susceptibility than SAC305 alloy (composition in wt\%: Sn=96,5\%, Ag=3\%, Cu=0,5\%). However on higher concentration levels, MTTF decreased and the failures usually happened in the same time on each solder alloy type. Failures were not happened in the case of X covered boards in case of 10 mM concentration.",

author = "Balint Medgyes and S{\'a}ndor {\'A}d{\'a}m and Lajos Tar and Vadimas Verdingovas and Rajan Ambat and G{\'a}bor Hars{\'a}nyi",

year = "2017",

doi = "10.1109/ISSE.2017.8000932",

language = "English",

booktitle = "Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017",

publisher = "IEEE",

address = "United States",

note = "40th International Spring Seminar on Electronics Technology ; Conference date: 10-05-2017 Through 14-05-2017",

}

Medgyes, B, Ádám, S, Tar, L, Verdingovas, V, Ambat, R & Harsányi, G 2017, Electrochemical migration of lead-free solder alloys in Na2SO4 environment. in Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017 . IEEE, 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, 10/05/2017. https://doi.org/10.1109/ISSE.2017.8000932

TY - GEN

T1 - Electrochemical migration of lead-free solder alloys in Na2SO4 environment

AU - Medgyes, Balint

AU - Ádám, Sándor

AU - Tar, Lajos

AU - Verdingovas, Vadimas

AU - Ambat, Rajan

AU - Harsányi, Gábor

PY - 2017

Y1 - 2017

N2 - The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of 0.1 and 1 mM Na2SO4 solutions X alloy (composition in wt%: Sn=90,95%, Ag=3,8%, Cu=0,7%, Bi=3%, Sb=1,4%, Ni=0,15%) has higher migration susceptibility than SAC305 alloy (composition in wt%: Sn=96,5%, Ag=3%, Cu=0,5%). However on higher concentration levels, MTTF decreased and the failures usually happened in the same time on each solder alloy type. Failures were not happened in the case of X covered boards in case of 10 mM concentration.

AB - The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of 0.1 and 1 mM Na2SO4 solutions X alloy (composition in wt%: Sn=90,95%, Ag=3,8%, Cu=0,7%, Bi=3%, Sb=1,4%, Ni=0,15%) has higher migration susceptibility than SAC305 alloy (composition in wt%: Sn=96,5%, Ag=3%, Cu=0,5%). However on higher concentration levels, MTTF decreased and the failures usually happened in the same time on each solder alloy type. Failures were not happened in the case of X covered boards in case of 10 mM concentration.

U2 - 10.1109/ISSE.2017.8000932

DO - 10.1109/ISSE.2017.8000932

M3 - Article in proceedings

BT - Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017

PB - IEEE

T2 - 40th International Spring Seminar on Electronics Technology

Y2 - 10 May 2017 through 14 May 2017

ER -

Electrochemical migration of lead-free solder alloys in Na2SO4 environment

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