Electrochemical migration of lead-free solder alloys in Na2SO4 environment

Balint Medgyes, Sándor Ádám, Lajos Tar, Vadimas Verdingovas, Rajan Ambat, Gábor Harsányi

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Abstract

The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of 0.1 and 1 mM Na2SO4 solutions X alloy (composition in wt%: Sn=90,95%, Ag=3,8%, Cu=0,7%, Bi=3%, Sb=1,4%, Ni=0,15%) has higher migration susceptibility than SAC305 alloy (composition in wt%: Sn=96,5%, Ag=3%, Cu=0,5%). However on higher concentration levels, MTTF decreased and the failures usually happened in the same time on each solder alloy type. Failures were not happened in the case of X covered boards in case of 10 mM concentration.
Original languageEnglish
Title of host publicationProceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017
Number of pages6
PublisherIEEE
Publication date2017
ISBN (Electronic)978-1-5386-0582-0
DOIs
Publication statusPublished - 2017
Event40th International Spring Seminar on Electronics Technology - Sofia, Bulgaria
Duration: 10 May 201714 May 2017

Conference

Conference40th International Spring Seminar on Electronics Technology
CountryBulgaria
CitySofia
Period10/05/201714/05/2017

Cite this

Medgyes, B., Ádám, S., Tar, L., Verdingovas, V., Ambat, R., & Harsányi, G. (2017). Electrochemical migration of lead-free solder alloys in Na2SO4 environment. In Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017 IEEE. https://doi.org/10.1109/ISSE.2017.8000932