Effects of bonding and bakeout thermal cycles on pre- and post-irradiation microstructures, physical and mechanical properties of copper alloys

B.N. Singh; Morten Mostgaard Eldrup; D.J. Edwards; P. Toft

Effects of bonding and bakeout thermal cycles on pre- and post-irradiation microstructures, physical and mechanical properties of copper alloys

B.N. Singh, Morten Mostgaard Eldrup, D.J. Edwards, P. Toft

Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Research

Original language	English
Title of host publication	Program and abstracts for the 18th symposium on effects of radiation on materials
Number of pages	59
Place of Publication	Philadelphia, PA
Publisher	ASTM
Publication date	1996
Publication status	Published - 1996
Event	18th Symposium on Effects of Radiation on Materials - Hyannis, MA, United States Duration: 25 Jun 1996 → 27 Jun 1996

Conference

Conference	18th Symposium on Effects of Radiation on Materials
Country/Territory	United States
City	Hyannis, MA
Period	25/06/1996 → 27/06/1996

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title = "Effects of bonding and bakeout thermal cycles on pre- and post-irradiation microstructures, physical and mechanical properties of copper alloys",

keywords = "Industrielle materialer",

author = "B.N. Singh and Eldrup, {Morten Mostgaard} and D.J. Edwards and P. Toft",

year = "1996",

language = "English",

booktitle = "Program and abstracts for the 18th symposium on effects of radiation on materials",

publisher = "ASTM",

note = "18th Symposium on Effects of Radiation on Materials ; Conference date: 25-06-1996 Through 27-06-1996",

}

Singh, BN, Eldrup, MM, Edwards, DJ & Toft, P 1996, Effects of bonding and bakeout thermal cycles on pre- and post-irradiation microstructures, physical and mechanical properties of copper alloys. in Program and abstracts for the 18th symposium on effects of radiation on materials. ASTM, Philadelphia, PA, 18th Symposium on Effects of Radiation on Materials, Hyannis, MA, United States, 25/06/1996.

Effects of bonding and bakeout thermal cycles on pre- and post-irradiation microstructures, physical and mechanical properties of copper alloys. / Singh, B.N.; Eldrup, Morten Mostgaard; Edwards, D.J. et al.
Program and abstracts for the 18th symposium on effects of radiation on materials. Philadelphia, PA: ASTM, 1996.

Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Research

TY - ABST

T1 - Effects of bonding and bakeout thermal cycles on pre- and post-irradiation microstructures, physical and mechanical properties of copper alloys

AU - Singh, B.N.

AU - Eldrup, Morten Mostgaard

AU - Edwards, D.J.

AU - Toft, P.

PY - 1996

Y1 - 1996

KW - Industrielle materialer

M3 - Conference abstract in proceedings

BT - Program and abstracts for the 18th symposium on effects of radiation on materials

PB - ASTM

CY - Philadelphia, PA

T2 - 18th Symposium on Effects of Radiation on Materials

Y2 - 25 June 1996 through 27 June 1996

ER -