Effect of ionic contamination on climatic reliability of printed circuit board assemblies

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedings – Annual report year: 2013Researchpeer-review

Standard

Effect of ionic contamination on climatic reliability of printed circuit board assemblies. / Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan.

Proceedings of the European Corrosion Congress 2012: Safer world through better corrosion control . 2012.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedings – Annual report year: 2013Researchpeer-review

Harvard

Verdingovas, V, Jellesen, MS & Ambat, R 2012, Effect of ionic contamination on climatic reliability of printed circuit board assemblies. in Proceedings of the European Corrosion Congress 2012: Safer world through better corrosion control . EUROCORR 2012, Isatnbul, Turkey, 09/09/2012.

APA

Verdingovas, V., Jellesen, M. S., & Ambat, R. (2012). Effect of ionic contamination on climatic reliability of printed circuit board assemblies. In Proceedings of the European Corrosion Congress 2012: Safer world through better corrosion control

CBE

Verdingovas V, Jellesen MS, Ambat R. 2012. Effect of ionic contamination on climatic reliability of printed circuit board assemblies. In Proceedings of the European Corrosion Congress 2012: Safer world through better corrosion control .

MLA

Verdingovas, Vadimas, Morten Stendahl Jellesen, and Rajan Ambat "Effect of ionic contamination on climatic reliability of printed circuit board assemblies". Proceedings of the European Corrosion Congress 2012: Safer world through better corrosion control . 2012.

Vancouver

Verdingovas V, Jellesen MS, Ambat R. Effect of ionic contamination on climatic reliability of printed circuit board assemblies. In Proceedings of the European Corrosion Congress 2012: Safer world through better corrosion control . 2012

Author

Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan. / Effect of ionic contamination on climatic reliability of printed circuit board assemblies. Proceedings of the European Corrosion Congress 2012: Safer world through better corrosion control . 2012.

Bibtex

@inproceedings{78d4fca1ba5b49ef989672ec8d98d78a,
title = "Effect of ionic contamination on climatic reliability of printed circuit board assemblies",
abstract = "The effect of NaCl and weak organic acids (WOAs) in “no-clean” wave solder flux residues was studied on electrochemical migration (ECM), leakage current, and corrosion on surface mount chip capacitors using a test printed circuit board assembly (PCBA) substrate having known chip components. The investigations were performed under environmental conditions varying from non-condensation with 60{\%} RH at 25°C to near to condensation with 98{\%} RH at 25°C, and full condensation conditions. Near to condensation and full condensation conditions have been established by (i) lowering the temperature of PCBA while keeping the temperature and relative humidity constant inside the climatic chamber and (ii) applying single micro-droplets of water on the surface mount chip capacitors. Water layer formation on the PCBA was observed in-situ by introducing a video camera inside the climatic chamber. The ECM probability testing under droplet condition showed dependency on the type and amount of ionic contamination. Climatic testing of the test PCBAs pre-contaminated with NaCl and solder flux residues showed the importance of hygroscopic nature of ionic contamination to corrosion and leakage current due to water adsorption on the surface.",
author = "Vadimas Verdingovas and Jellesen, {Morten Stendahl} and Rajan Ambat",
year = "2012",
language = "English",
booktitle = "Proceedings of the European Corrosion Congress 2012",

}

RIS

TY - GEN

T1 - Effect of ionic contamination on climatic reliability of printed circuit board assemblies

AU - Verdingovas, Vadimas

AU - Jellesen, Morten Stendahl

AU - Ambat, Rajan

PY - 2012

Y1 - 2012

N2 - The effect of NaCl and weak organic acids (WOAs) in “no-clean” wave solder flux residues was studied on electrochemical migration (ECM), leakage current, and corrosion on surface mount chip capacitors using a test printed circuit board assembly (PCBA) substrate having known chip components. The investigations were performed under environmental conditions varying from non-condensation with 60% RH at 25°C to near to condensation with 98% RH at 25°C, and full condensation conditions. Near to condensation and full condensation conditions have been established by (i) lowering the temperature of PCBA while keeping the temperature and relative humidity constant inside the climatic chamber and (ii) applying single micro-droplets of water on the surface mount chip capacitors. Water layer formation on the PCBA was observed in-situ by introducing a video camera inside the climatic chamber. The ECM probability testing under droplet condition showed dependency on the type and amount of ionic contamination. Climatic testing of the test PCBAs pre-contaminated with NaCl and solder flux residues showed the importance of hygroscopic nature of ionic contamination to corrosion and leakage current due to water adsorption on the surface.

AB - The effect of NaCl and weak organic acids (WOAs) in “no-clean” wave solder flux residues was studied on electrochemical migration (ECM), leakage current, and corrosion on surface mount chip capacitors using a test printed circuit board assembly (PCBA) substrate having known chip components. The investigations were performed under environmental conditions varying from non-condensation with 60% RH at 25°C to near to condensation with 98% RH at 25°C, and full condensation conditions. Near to condensation and full condensation conditions have been established by (i) lowering the temperature of PCBA while keeping the temperature and relative humidity constant inside the climatic chamber and (ii) applying single micro-droplets of water on the surface mount chip capacitors. Water layer formation on the PCBA was observed in-situ by introducing a video camera inside the climatic chamber. The ECM probability testing under droplet condition showed dependency on the type and amount of ionic contamination. Climatic testing of the test PCBAs pre-contaminated with NaCl and solder flux residues showed the importance of hygroscopic nature of ionic contamination to corrosion and leakage current due to water adsorption on the surface.

M3 - Article in proceedings

BT - Proceedings of the European Corrosion Congress 2012

ER -