Effect of interior geometry on local climate inside an electronic device enclosure

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

Electronic enclosure design and the internal arrangement of PCBs and components influence microclimate inside the enclosure. This work features a general electronic unit with parallel PCBs. One of the PCB is considered to have heat generating components on it. The humidity and temperature profiles near the surface of PCBs depend on various factors like inter-PCB spacing, controlled opening size, and heat capacity of various parts. The effect of above mentioned factors on the humidity and temperature profiles are investigated for both transient and steady state operating conditions of the electronic device. The experiments are conducted for the case of condensed water present in the enclosure. A rectangular enclosure made of aluminium is used for the study. PCBs closer to heated surfaces are found to have lower relative humidity and less probability to failure. This is confirmed by impedance measurements on the PCBs. Enclosures with smaller opening sizes are observed to have lower relative humidity. Results also show possibility of using heat capacity of materials to store and release heat energy for control of humidity. This paper provides an improved understanding of the effect of internal geometry of the device and related enclosure design parameters on the humidity and temperature profiles inside the electronic device enclosure.
Original languageEnglish
Title of host publicationProceedings of the 16th IEEE Intersociety Conference onThermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017)
PublisherIEEE
Publication date2017
Pages779-783
ISBN (Electronic)978-1-5090-2994-5
DOIs
Publication statusPublished - 2017
Event16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017) - Orlando, United States
Duration: 30 May 20172 Jun 2017

Conference

Conference16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017)
CountryUnited States
CityOrlando
Period30/05/201702/06/2017

Keywords

  • Humidity
  • Temperature
  • Thermal mass
  • Electronic enclosure
  • Microclimate

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