Effect of interior geometry on local climate inside an electronic device enclosure

Salil Joshy; Morten Stendahl Jellesen; Rajan Ambat

doi:10.1109/ITHERM.2017.7992565

Effect of interior geometry on local climate inside an electronic device enclosure

Salil Joshy, Morten Stendahl Jellesen, Rajan Ambat

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Abstract

Electronic enclosure design and the internal arrangement of PCBs and components influence microclimate inside the enclosure. This work features a general electronic unit with parallel PCBs. One of the PCB is considered to have heat generating components on it. The humidity and temperature profiles near the surface of PCBs depend on various factors like inter-PCB spacing, controlled opening size, and heat capacity of various parts. The effect of above mentioned factors on the humidity and temperature profiles are investigated for both transient and steady state operating conditions of the electronic device. The experiments are conducted for the case of condensed water present in the enclosure. A rectangular enclosure made of aluminium is used for the study. PCBs closer to heated surfaces are found to have lower relative humidity and less probability to failure. This is confirmed by impedance measurements on the PCBs. Enclosures with smaller opening sizes are observed to have lower relative humidity. Results also show possibility of using heat capacity of materials to store and release heat energy for control of humidity. This paper provides an improved understanding of the effect of internal geometry of the device and related enclosure design parameters on the humidity and temperature profiles inside the electronic device enclosure.

Original language	English
Title of host publication	Proceedings of the 16th IEEE Intersociety Conference onThermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017)
Publisher	IEEE
Publication date	2017
Pages	779-783
ISBN (Electronic)	978-1-5090-2994-5
DOIs	https://doi.org/10.1109/ITHERM.2017.7992565
Publication status	Published - 2017
Event	2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Orlando, United States Duration: 30 May 2017 → 2 Jun 2017 Conference number: 16 https://ieeexplore.ieee.org/xpl/conhome/7983314/proceeding

Conference

Conference	2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Number	16
Country/Territory	United States
City	Orlando
Period	30/05/2017 → 02/06/2017
Internet address	https://ieeexplore.ieee.org/xpl/conhome/7983314/proceeding

Keywords

Humidity
Temperature
Thermal mass
Electronic enclosure
Microclimate

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10.1109/ITHERM.2017.7992565

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title = "Effect of interior geometry on local climate inside an electronic device enclosure",

abstract = "Electronic enclosure design and the internal arrangement of PCBs and components influence microclimate inside the enclosure. This work features a general electronic unit with parallel PCBs. One of the PCB is considered to have heat generating components on it. The humidity and temperature profiles near the surface of PCBs depend on various factors like inter-PCB spacing, controlled opening size, and heat capacity of various parts. The effect of above mentioned factors on the humidity and temperature profiles are investigated for both transient and steady state operating conditions of the electronic device. The experiments are conducted for the case of condensed water present in the enclosure. A rectangular enclosure made of aluminium is used for the study. PCBs closer to heated surfaces are found to have lower relative humidity and less probability to failure. This is confirmed by impedance measurements on the PCBs. Enclosures with smaller opening sizes are observed to have lower relative humidity. Results also show possibility of using heat capacity of materials to store and release heat energy for control of humidity. This paper provides an improved understanding of the effect of internal geometry of the device and related enclosure design parameters on the humidity and temperature profiles inside the electronic device enclosure.",

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author = "Salil Joshy and Jellesen, {Morten Stendahl} and Rajan Ambat",

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address = "United States",

note = "2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, iTherm 2017 ; Conference date: 30-05-2017 Through 02-06-2017",

url = "https://ieeexplore.ieee.org/xpl/conhome/7983314/proceeding",

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Joshy, S, Jellesen, MS & Ambat, R 2017, Effect of interior geometry on local climate inside an electronic device enclosure. in Proceedings of the 16th IEEE Intersociety Conference onThermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017) . IEEE, pp. 779-783, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, Florida, United States, 30/05/2017. https://doi.org/10.1109/ITHERM.2017.7992565

Effect of interior geometry on local climate inside an electronic device enclosure. / Joshy, Salil; Jellesen, Morten Stendahl ; Ambat, Rajan.
Proceedings of the 16th IEEE Intersociety Conference onThermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017) . IEEE, 2017. p. 779-783.

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

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Effect of interior geometry on local climate inside an electronic device enclosure

Abstract

Conference

Keywords

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