Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C

D.J. Edwards, B.N. Singh, P. Toft, Morten Mostgaard Eldrup

    Research output: Contribution to conferencePosterResearch

    Original languageEnglish
    Publication date1997
    Publication statusPublished - 1997
    EventPoster presentation at the ICFRM-8 - Sendai, Japan
    Duration: 26 Oct 199731 Oct 1997

    Conference

    ConferencePoster presentation at the ICFRM-8
    CountryJapan
    CitySendai
    Period26/10/199731/10/1997

    Cite this

    Edwards, D. J., Singh, B. N., Toft, P., & Eldrup, M. M. (1997). Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C. Poster session presented at Poster presentation at the ICFRM-8, Sendai, Japan.
    Edwards, D.J. ; Singh, B.N. ; Toft, P. ; Eldrup, Morten Mostgaard. / Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C. Poster session presented at Poster presentation at the ICFRM-8, Sendai, Japan.
    @conference{ca6ed7d0c9a049c0bdc2e635b37460d5,
    title = "Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C",
    keywords = "Industrielle materialer",
    author = "D.J. Edwards and B.N. Singh and P. Toft and Eldrup, {Morten Mostgaard}",
    year = "1997",
    language = "English",
    note = "Poster presentation at the ICFRM-8 ; Conference date: 26-10-1997 Through 31-10-1997",

    }

    Edwards, DJ, Singh, BN, Toft, P & Eldrup, MM 1997, 'Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C' Poster presentation at the ICFRM-8, Sendai, Japan, 26/10/1997 - 31/10/1997, .

    Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C. / Edwards, D.J.; Singh, B.N.; Toft, P.; Eldrup, Morten Mostgaard.

    1997. Poster session presented at Poster presentation at the ICFRM-8, Sendai, Japan.

    Research output: Contribution to conferencePosterResearch

    TY - CONF

    T1 - Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C

    AU - Edwards, D.J.

    AU - Singh, B.N.

    AU - Toft, P.

    AU - Eldrup, Morten Mostgaard

    PY - 1997

    Y1 - 1997

    KW - Industrielle materialer

    M3 - Poster

    ER -

    Edwards DJ, Singh BN, Toft P, Eldrup MM. Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C. 1997. Poster session presented at Poster presentation at the ICFRM-8, Sendai, Japan.