Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C

D.J. Edwards, B.N. Singh, P. Toft, Morten Mostgaard Eldrup

Research output: Contribution to conference › Poster › Research

Original language	English
Publication date	1997
Publication status	Published - 1997
Event	Poster presentation at the ICFRM-8 - Sendai, Japan Duration: 26 Oct 1997 → 31 Oct 1997

Conference	Poster presentation at the ICFRM-8
Country/Territory	Japan
City	Sendai
Period	26/10/1997 → 31/10/1997

OpenUrl availability

@conference{ca6ed7d0c9a049c0bdc2e635b37460d5,

title = "Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C",

keywords = "Industrielle materialer",

author = "D.J. Edwards and B.N. Singh and P. Toft and Eldrup, {Morten Mostgaard}",

year = "1997",

language = "English",

note = "Poster presentation at the ICFRM-8 ; Conference date: 26-10-1997 Through 31-10-1997",

}