Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C

D.J. Edwards, B.N. Singh, P. Toft, Morten Mostgaard Eldrup

    Research output: Contribution to conferencePosterResearch

    Original languageEnglish
    Publication date1997
    Publication statusPublished - 1997
    EventPoster presentation at the ICFRM-8 - Sendai, Japan
    Duration: 26 Oct 199731 Oct 1997

    Conference

    ConferencePoster presentation at the ICFRM-8
    CountryJapan
    CitySendai
    Period26/10/199731/10/1997

    Cite this

    Edwards, D. J., Singh, B. N., Toft, P., & Eldrup, M. M. (1997). Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degr.C. Poster session presented at Poster presentation at the ICFRM-8, Sendai, Japan.