Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 350 degrees C

B.N. Singh, D.J. Edwards, Morten Mostgaard Eldrup, P. Toft

    Research output: Contribution to journalJournal articleResearchpeer-review

    Abstract

    Screening experiments were carried out to determine the effect of bonding and bakeout thermal cycles on microstructure, mechanical properties and electrical resistivity of the oxide dispersion strengthened (GlidCop, CuAl-25) and the precipitation hardened (CuCrZr, CuNiBe) copper alloys. Tensile specimens were given heat treatments corresponding to solution anneal, prime-aging, bonding thermal treatment followed by re-aging and the reactor bakeout treatment. A number of specimens were irradiated at 350 degreesC to a dose level of similar or equal to0.3 dpa in the DR-3 reactor at Riso. Both unirradiated and irradiated specimens were tensile tested at 350 degreesC. The microstructure and electrical resistivity were determined in the unirradiated and irradiated conditions. The post-deformation microstructure and fracture surfaces of unirradiated and irradiated specimens were examined. The main results are described and their salient features discussed. The most significant effect of neutron irradiation is a severe loss of ductility in the case of CuNiBe alloys. (C) 2001 Elsevier Science B.V. All rights reserved.
    Original languageEnglish
    JournalJournal of Nuclear Materials
    Volume295
    Issue number1
    Pages (from-to)1-15
    ISSN0022-3115
    DOIs
    Publication statusPublished - May 2001

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