EBSP studies of growth rates during recrystallization

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Abstract

    The use of the electron back scattering pattern (EBSP) technique to study effects of crystallographic orientation on growth is reviewed. The experimental set-up and data handling procedures are shortly introduced and two different approaches to study orientation effects on growth are described. The potential of the EBSP technique for both these types of measurements is illustrated for recrystallization of heavily deformed aluminium. It is discussed how these approaches apply to grain growth. Finally, new possibilities for in-situ grain growth studies by 3D mapping of orientations in the bulk of a sample by synchrotron radiation techniques are briefly addressed.
    Original languageEnglish
    Title of host publicationGrain Growth in Polycrystalline Materials II
    VolumeParts 1-2
    PublisherTranstec Publications LTD
    Publication date1996
    Pages713-722
    ISBN (Print)0-87849-719-6
    DOIs
    Publication statusPublished - 1996
    EventInternational Conference on Grain Growth in Polycrystalline Materials - Kitakyshu, Japan
    Duration: 17 May 199520 May 1995
    Conference number: 2

    Conference

    ConferenceInternational Conference on Grain Growth in Polycrystalline Materials
    Number2
    CountryJapan
    CityKitakyshu
    Period17/05/199520/05/1995
    SeriesMaterials Science Forum
    Volume204-206
    ISSN0255-5476

    Keywords

    • EBSP
    • growth rates
    • recrystallization
    • synchrotron

    Fingerprint Dive into the research topics of 'EBSP studies of growth rates during recrystallization'. Together they form a unique fingerprint.

    Cite this