Abstract
The use of the electron back scattering pattern (EBSP) technique to study effects of crystallographic orientation on growth is reviewed. The experimental set-up and data handling procedures are shortly introduced and two different approaches to study orientation effects on growth are described. The potential of the EBSP technique for both these types of measurements is illustrated for recrystallization of heavily deformed aluminium. It is discussed how these approaches apply to grain growth. Finally, new possibilities for in-situ grain growth studies by 3D mapping of orientations in the bulk of a sample by synchrotron radiation techniques are briefly addressed.
Original language | English |
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Title of host publication | Grain Growth in Polycrystalline Materials II |
Volume | Parts 1-2 |
Publisher | Transtec Publications LTD |
Publication date | 1996 |
Pages | 713-722 |
ISBN (Print) | 0-87849-719-6 |
DOIs | |
Publication status | Published - 1996 |
Event | International Conference on Grain Growth in Polycrystalline Materials - Kitakyshu, Japan Duration: 17 May 1995 → 20 May 1995 Conference number: 2 |
Conference
Conference | International Conference on Grain Growth in Polycrystalline Materials |
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Number | 2 |
Country/Territory | Japan |
City | Kitakyshu |
Period | 17/05/1995 → 20/05/1995 |
Series | Materials Science Forum |
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Volume | 204-206 |
ISSN | 0255-5476 |
Keywords
- EBSP
- growth rates
- recrystallization
- synchrotron