EBSD Analysis of Deformed and Partially Recrystallized Microstructures in ECAE-Processed Copper

Oleg Mishin, Jacob R. Bowen, A. Godfrey

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Abstract

The deformed microstructure and recrystallization behavior of copper samples processed using equal channel angular extrusion (ECAE) have been investigated. The heavily deformed microstructure was found to be non-uniform through the sample thickness and to vary in a manner consistent with the non-uniform distribution of strain imposed by processing. The through-thickness heterogeneity of the deformed microstructure resulted in a different extent of recrystallization in different layers during annealing. Recrystallized grains were also observed in samples that were not annealed, but stored at room temperature, which indicates that the deformed microstructure of ECAE-processed pure copper is unstable even at room temperature. In each sample, recrystallization was found to initiate in regions containing predominantly large misorientations.
Original languageEnglish
JournalMaterials Science Forum
Volume715-716
Pages (from-to)825-830
ISSN0255-5476
DOIs
Publication statusPublished - 2012
Event4th International Conference on Recrystallization and Grain Growth - Sheffield, United Kingdom
Duration: 4 Jul 20109 Jul 2010

Conference

Conference4th International Conference on Recrystallization and Grain Growth
Country/TerritoryUnited Kingdom
CitySheffield
Period04/07/201009/07/2010

Keywords

  • Copper
  • Equal channel angular extrusion (ECAE)
  • Severe plastic deformation
  • Partial recrystallization

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