Dry release of all-polymer structures

D. Haefliger, M. Nordstrøm, Peter Andreas Rasmussen, Anja Boisen

    Research output: Contribution to journalJournal articleResearchpeer-review

    Abstract

    We present a simple dry release technique which uses a thin fluorocarbon film for efficient removal of plastic microdevices from a mould or a handling substrate by reducing the adhesion between the two. This fluorocarbon film is deposited on the substrate in an advanced Si dry etch device utilising the C4F8 passivation plasma. Micromachined polymer chips made of SU-8 are removed from the handling substrate by lifting them off using mechanical tweezers. Effective release of chips of several mm(2) size within a few seconds and the lift-off of fragile, 5.5-mu m-thin cantilevers at a yield of almost 100% were demonstrated on wafer-scale. The fluorocarbon film showed excellent compatibility with metal etch processes and polymer baking and curing steps. It further facilitates demoulding of polydimethylsiloxane stamps suitable for soft-lithography.
    Original languageEnglish
    JournalMicroelectronic Engineering
    Volume78-79
    Pages (from-to)88-92
    ISSN0167-9317
    DOIs
    Publication statusPublished - 2005

    Keywords

    • fluorocarbon film
    • polymer
    • SU-8
    • plasma deposition
    • soft-lithography
    • release

    Fingerprint Dive into the research topics of 'Dry release of all-polymer structures'. Together they form a unique fingerprint.

    Cite this