We present a new method to define metal electrodes on top of high-aspect-ratio microstructures using standard photolithography equipment and a single chromium mask. A lift-off resist (LOR) layer is implemented in an SU-8 photolithography process to selectively remove metal at the end of the processing. In this way, we have successfully defined metal electrodes on top of 75 mu m high SU-8 microstructures to be used as test structures for the measurement of temperature increase due to inductive heating.
- Double layer LOR/positive photoresist lift-off
- SU-8 microfabrication
- Metallization of high-aspect-ratio structures
Ouattara, L., Knutzen, M., Keller, S. U., Hansen, M. F., & Boisen, A. (2010). Double layer resist process scheme for metal lift-off with application in inductive heating of microstructures. Microelectronic Engineering, 87(5-8), 1226-1228. https://doi.org/10.1016/j.mee.2009.11.147