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Doping technologies for InP membranes on silicon for nanolasers

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    Abstract

    We present a systematic study of Zn thermal diffusion and Si ion implantation with subsequent rapid thermal annealing as the methods to fabricate lateral p-i-n junctions in InP membranes on silicon for use in electrically pumped in-plane nanolasers. We describe in detail optimized fabrication steps, which include MOVPE growth of InGaAs/InP epilayers, 2" InP to 4" SiO 2 /Si direct bonding, and several cycles of DUV lithography. Values for sheet resistance of p-InGaAs/InP and n-InP membranes are obtained, which correspond to carrier concentration levels higher than 10 18 cm -3 for both Zndiffused p-InP and Si-implanted n-InP.

    Original languageEnglish
    Title of host publicationProceedings of SPIE
    EditorsAlexey A. Belyanin, Peter M. Smowton
    Number of pages10
    Volume10939
    PublisherSPIE - International Society for Optical Engineering
    Publication date1 Jan 2019
    Article number109390U
    ISBN (Electronic)9781510625204
    DOIs
    Publication statusPublished - 1 Jan 2019
    EventSPIE Photonics West OPTO 2019 - The Moscone Center, San Francisco, United States
    Duration: 2 Feb 20197 Feb 2019

    Conference

    ConferenceSPIE Photonics West OPTO 2019
    LocationThe Moscone Center
    Country/TerritoryUnited States
    CitySan Francisco
    Period02/02/201907/02/2019
    SponsorSPIE
    SeriesProceedings of SPIE - The International Society for Optical Engineering
    Volume10939
    ISSN0277-786X

    Keywords

    • Doping
    • III-V on silicon
    • InP membrane
    • Si ion implantation
    • Wafer bonding
    • Zn diffusion

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