Development of lead-free solders for high-temperature applications

This work also reviews the alternative technologies for replacing the high-temperature soldering since it was determined that even the expensive candidate alloys involving Au too could not cover the spectrum of properties required for being accepted as a standard soft solder for high-temperature applications. Unfortunately, even the substitute technologies that are currently being developed cannot address several critical issues of high-temperature soldering. Therefore, further research and development of high-temperature lead-free soldering is obviously needed. It is hoped that this thesis can serve as a valuable source of information to those interested in environmentally conscious electronic packaging.