Determination of packaging induced 3D stress utilizing a piezocoefficient mapping device

Jacob Richter, A. Hyldgård, Karen Birkelund, Morten Berg Arnoldus, Ole Hansen, Erik Vilain Thomsen

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    Abstract

    This paper presents a novel method to determine 3D stress in microsystem packaging. The stress components sigmaxx, sigmayy, sigmazz, and sigmaxy are found in an epoxy package using a piezocoefficient mapping device as stress sensor. We spin the current 360deg in a circular n-type (001) Si piezoresistor by contacts located near the perimeter of the resistor and do high impedance voltage measurements on contacts located near the centre of the resistor. By measuring the potential drops in these contacts we can determine the stress in the chip. The epoxy is potted in a polystyrene tube using the same concept as in [1] used for chip packaging for fisheries research. We investigate the EpoTek 305 epoxy and find stress values of sigmaxx ap -23 MPa, sigmayy ap -1 MPa, sigmaxy = 0.3 MPa, and sigmazz = 40 MPa. The presented method can be used for 3D stress measurements of various packaging concepts.
    Original languageEnglish
    Title of host publication20th IEEE International Micro Electro Mechanical Systems (MEMS) Conference
    PublisherIEEE
    Publication date2007
    Pages69-72
    ISBN (Print)1-4244-0951-9
    DOIs
    Publication statusPublished - 2007
    Event20th IEEE International Micro Electro Mechanical Systems (MEMS) Conference - Kobe, Japan
    Duration: 1 Jan 2007 → …

    Conference

    Conference20th IEEE International Micro Electro Mechanical Systems (MEMS) Conference
    CityKobe, Japan
    Period01/01/2007 → …

    Bibliographical note

    Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

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